Jianmin Fang

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming openings through insulat...
- Patent number 11,127,666
- Issue date Sep 21, 2021
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a low profile embedded...
- Patent number 10,622,293
- Issue date Apr 14, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming shielding layer over int...
- Patent number 10,211,183
- Issue date Feb 19, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial protective l...
- Patent number 10,204,866
- Issue date Feb 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical interconnect st...
- Patent number 10,192,801
- Issue date Jan 29, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with dummy metal protective structure around s...
- Patent number 10,163,815
- Issue date Dec 25, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out structure with...
- Patent number 9,865,482
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming repassivation layer for...
- Patent number 9,754,867
- Issue date Sep 5, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming openings through insulat...
- Patent number 9,601,434
- Issue date Mar 21, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial protective l...
- Patent number 9,558,958
- Issue date Jan 31, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming repassivation layer for...
- Patent number 9,548,240
- Issue date Jan 17, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming repassivation layer with...
- Patent number 9,472,452
- Issue date Oct 18, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,401,331
- Issue date Jul 26, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming shielding layer over int...
- Patent number 9,324,700
- Issue date Apr 26, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a low profile embedded...
- Patent number 9,293,401
- Issue date Mar 22, 2016
- STATS ChipPAC, Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an IPD over a high-resis...
- Patent number 9,269,598
- Issue date Feb 23, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a conductive via-in-via...
- Patent number 9,252,075
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL over contact pad wit...
- Patent number 9,202,713
- Issue date Dec 1, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having embedded integrated passive devices ele...
- Patent number 9,184,103
- Issue date Nov 10, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 9,087,930
- Issue date Jul 21, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial protective l...
- Patent number 8,907,476
- Issue date Dec 9, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a vertical interconnect structure for 3-D...
- Patent number 8,796,846
- Issue date Aug 5, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming repassivation layer with...
- Patent number 8,786,100
- Issue date Jul 22, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective structure aro...
- Patent number 8,642,446
- Issue date Feb 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming passive circuit element...
- Patent number 8,592,311
- Issue date Nov 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with mult...
- Patent number 8,575,018
- Issue date Nov 5, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL wider than contact p...
- Patent number 8,501,618
- Issue date Aug 6, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming insulating layer dispose...
- Patent number 8,456,002
- Issue date Jun 4, 2013
- Stats Chippac Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an inductor within inter...
- Patent number 8,445,990
- Issue date May 21, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with semiconductor core structure and method...
- Patent number 8,445,323
- Issue date May 21, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Openings Through Insulat...
- Publication number 20170148721
- Publication date May 25, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
- Publication number 20170098612
- Publication date Apr 6, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer for...
- Publication number 20170084526
- Publication date Mar 23, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Shielding Layer over Int...
- Publication number 20160197059
- Publication date Jul 7, 2016
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Low Profile Embedded...
- Publication number 20160141238
- Publication date May 19, 2016
- STATS ChipPAC, Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer for...
- Publication number 20150155248
- Publication date Jun 4, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
- Publication number 20150008597
- Publication date Jan 8, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer with...
- Publication number 20140252654
- Publication date Sep 11, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20140246779
- Publication date Sep 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20140239495
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Protective Structure Around Semiconductor...
- Publication number 20140084424
- Publication date Mar 27, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Dispose...
- Publication number 20130175696
- Publication date Jul 11, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer with...
- Publication number 20130056879
- Publication date Mar 7, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Passive Circuit Element...
- Publication number 20130015554
- Publication date Jan 17, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Conductive Via-in-Via...
- Publication number 20120326329
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- Lionel Chien Hui Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Mult...
- Publication number 20120299176
- Publication date Nov 29, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an IPD over a High-Resis...
- Publication number 20120292738
- Publication date Nov 22, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
- Publication number 20120199965
- Publication date Aug 9, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Fan-Out Structure with...
- Publication number 20120187572
- Publication date Jul 26, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Semiconductor Core Structure and Method...
- Publication number 20120175732
- Publication date Jul 12, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertical Interconnect St...
- Publication number 20120175784
- Publication date Jul 12, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Openings Through Insulat...
- Publication number 20120146236
- Publication date Jun 14, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Inductor Within Inter...
- Publication number 20120146181
- Publication date Jun 14, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Structure Aro...
- Publication number 20120074534
- Publication date Mar 29, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL Wider than Contact P...
- Publication number 20120018904
- Publication date Jan 26, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming RDL over Contact Pad wit...
- Publication number 20120018874
- Publication date Jan 26, 2012
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Around...
- Publication number 20110221041
- Publication date Sep 15, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Repassivation Layer with...
- Publication number 20110221055
- Publication date Sep 15, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Protective L...
- Publication number 20110221057
- Publication date Sep 15, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Embedded Integrated Passive Devices Ele...
- Publication number 20110163414
- Publication date Jul 7, 2011
- STATS ChiPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Jianmin Fang

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming openings through insulat...

Semiconductor device and method for forming a low profile embedded...

Semiconductor device and method of forming shielding layer over int...

Semiconductor device and method of forming sacrificial protective l...

Semiconductor device and method of forming vertical interconnect st...

Semiconductor device with dummy metal protective structure around s...

Semiconductor device and method of forming a fan-out structure with...

Semiconductor device and method of forming repassivation layer for...

Semiconductor device and method of forming openings through insulat...

Semiconductor device and method of forming sacrificial protective l...

Semiconductor device and method of forming repassivation layer for...

Semiconductor device and method of forming repassivation layer with...

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device and method of forming shielding layer over int...

Semiconductor device and method for forming a low profile embedded...

Semiconductor device and method of forming an IPD over a high-resis...

Semiconductor device and method of forming a conductive via-in-via...

Semiconductor device and method of forming RDL over contact pad wit...

Semiconductor device having embedded integrated passive devices ele...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device and method of forming sacrificial protective l...

Semiconductor device with a vertical interconnect structure for 3-D...

Semiconductor device and method of forming repassivation layer with...

Semiconductor device and method of forming protective structure aro...

Semiconductor device and method for forming passive circuit element...

Semiconductor device and method of forming bump structure with mult...

Semiconductor device and method of forming RDL wider than contact p...

Semiconductor device and method of forming insulating layer dispose...

Semiconductor device and method of forming an inductor within inter...

Semiconductor package with semiconductor core structure and method...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Openings Through Insulat...

Semiconductor Device and Method of Forming Sacrificial Protective L...

Semiconductor Device and Method of Forming Repassivation Layer for...

Semiconductor Device and Method of Forming Shielding Layer over Int...

Semiconductor Device and Method for Forming a Low Profile Embedded...

Semiconductor Device and Method of Forming Repassivation Layer for...

Semiconductor Device and Method of Forming Sacrificial Protective L...

Semiconductor Device and Method of Forming Repassivation Layer with...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device and Method of Forming a Vertical Interconnect...

Semiconductor Device with Protective Structure Around Semiconductor...

Semiconductor Device and Method of Forming Insulating Layer Dispose...

Semiconductor Device and Method of Forming Repassivation Layer with...

Semiconductor Device and Method for Forming Passive Circuit Element...

Semiconductor Device and Method of Forming a Conductive Via-in-Via...

Semiconductor Device and Method of Forming Bump Structure with Mult...

Semiconductor Device and Method of Forming an IPD over a High-Resis...

Semiconductor Device and Method of Forming Sacrificial Protective L...

Semiconductor Device and Method of Forming a Fan-Out Structure with...

Semiconductor Package with Semiconductor Core Structure and Method...

Semiconductor Device and Method of Forming Vertical Interconnect St...

Semiconductor Device and Method of Forming Openings Through Insulat...

Semiconductor Device and Method of Forming an Inductor Within Inter...

Semiconductor Device and Method of Forming Protective Structure Aro...

Semiconductor Device and Method of Forming RDL Wider than Contact P...

Semiconductor Device and Method of Forming RDL over Contact Pad wit...

Semiconductor Device and Method of Forming Insulating Layer Around...

Semiconductor Device and Method of Forming Repassivation Layer with...

Semiconductor Device and Method of Forming Sacrificial Protective L...

Semiconductor Device Having Embedded Integrated Passive Devices Ele...