Jianmin Feng

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming RDL wider than contact pad along first axis and n...
- Patent number 8,962,476
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming RDL Wider than Contact P...
- Publication number 20130249111
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS