Jianmin Li

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
System and method for detecting voltage of battery pack
- Patent number 10,353,011
- Issue date Jul 16, 2019
- CHINA RESOURCES POWTECH (SHANGHAI) CO., LTD.
- Yong You
- G01 - MEASURING TESTING
Information Patent Grant
Copper plating connection for multi-die stack in substrate package
- Patent number 7,981,726
- Issue date Jul 19, 2011
- Intel Corporation
- John J. Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR DETECTING VOLTAGE OF BATTERY PACK
- Publication number 20170292997
- Publication date Oct 12, 2017
- CHINA RESOURCES POWTECH (SHANGHAI) CO., LTD.
- YONG YOU
- G01 - MEASURING TESTING
Information Patent Application
Copper plating connection for multi-die stack in substrate package
- Publication number 20070132082
- Publication date Jun 14, 2007
- Intel Corporation
- John J. Tang
- H01 - BASIC ELECTRIC ELEMENTS