Jiann-Jong Wang

Person

Tao-Yuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Tape residue-free bump area after wafer back grinding
- Patent number 8,642,390
- Issue date Feb 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for planarization of dielectric layer around metal patterns...
- Patent number 7,750,470
- Issue date Jul 6, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeou-Lang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for planarization of dielectric layer around metal patterns...
- Patent number 7,196,012
- Issue date Mar 27, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeou-Lang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP process leaving no residual oxide layer or slurry particles
- Patent number 7,125,802
- Issue date Oct 24, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Lang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP process leaving no residual oxide layer or slurry particles
- Patent number 6,903,019
- Issue date Jun 7, 2005
- Taiwan Semiconductor Manufacturing Company
- Ying-Lang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP process leaving no residual oxide layer or slurry particles
- Patent number 6,660,638
- Issue date Dec 9, 2003
- Taiwan Semiconductor Manufacturing Company
- Ying-Lang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for performing a pre-amorphization implant (PAI) which provi...
- Patent number 6,187,655
- Issue date Feb 13, 2001
- Taiwan Semiconductor Manufacturing Company
- Jiann-Jong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ARC layer enhancement for reducing metal loss during via etch
- Patent number 6,005,277
- Issue date Dec 21, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chwen-Ming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic lot dispatching required turn rate factory control system a...
- Patent number 5,818,716
- Issue date Oct 6, 1998
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Cheng Chin
- G05 - CONTROLLING REGULATING
Information Patent Grant
Tapered opening sidewall with multi-step etching process
- Patent number 5,180,689
- Issue date Jan 19, 1993
- Taiwan Semiconductor Manufacturing Company
- Hsien-Tsung Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TAPE RESIDUE-FREE BUMP AREA AFTER WAFER BACK GRINDING
- Publication number 20110230043
- Publication date Sep 22, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNITIZED CHARGING AND DISCHARGING BATTERY MANAGEMENT SYSTEM AND PRO...
- Publication number 20110181245
- Publication date Jul 28, 2011
- National Chip Implementation Center National Applied Research Laboratories
- Chin-Long Wey
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for planarization of dielectric layer around metal patterns...
- Publication number 20080191249
- Publication date Aug 14, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeou-Lang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for planarization of dielectric layer around metal patterns...
- Publication number 20050227490
- Publication date Oct 13, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yeou-Lang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP process leaving no residual oxide layer or slurry particles
- Publication number 20040097083
- Publication date May 20, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ying-Lang Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP process leaving no residual oxide layer or slurry particles
- Publication number 20040084415
- Publication date May 6, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ying-Lang Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Jiann-Jong Wang

Person

Patents Grantslast 30 patents

Tape residue-free bump area after wafer back grinding

Methods for planarization of dielectric layer around metal patterns...

Methods for planarization of dielectric layer around metal patterns...

CMP process leaving no residual oxide layer or slurry particles

CMP process leaving no residual oxide layer or slurry particles

CMP process leaving no residual oxide layer or slurry particles

Method for performing a pre-amorphization implant (PAI) which provi...

ARC layer enhancement for reducing metal loss during via etch

Dynamic lot dispatching required turn rate factory control system a...

Tapered opening sidewall with multi-step etching process

Patents Applicationslast 30 patents

TAPE RESIDUE-FREE BUMP AREA AFTER WAFER BACK GRINDING

UNITIZED CHARGING AND DISCHARGING BATTERY MANAGEMENT SYSTEM AND PRO...

Methods for planarization of dielectric layer around metal patterns...

Methods for planarization of dielectric layer around metal patterns...

CMP process leaving no residual oxide layer or slurry particles

CMP process leaving no residual oxide layer or slurry particles