Jiann-Liang Liou

Follow

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method to improve adhesion of molding compound by providing an oxyg...
- Patent number 6,479,402
- Issue date Nov 12, 2002
- Taiwan Semiconductor Manufacturing Company
- Chie-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS