Jiann-Lih WU

Person

Hsin-Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for polishing semiconductor substrate
- Patent number 11,999,027
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- James Jeng-Jyi Hwang
- B24 - GRINDING POLISHING
Information Patent Grant
Device and methods for chemical mechanical polishing
- Patent number 11,772,227
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- James Jeng-Jyi Hwang
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing head, system thereof, and method using the same
- Patent number 11,602,821
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- James Jeng-Jyi Hwang
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and methods for chemical mechanical polishing
- Patent number 10,875,143
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- James Jeng-Jyi Hwang
- B24 - GRINDING POLISHING
Information Patent Grant
High throughput CMP platform
- Patent number 10,513,006
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiann Lih Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-point chemical mechanical polishing end point detection syste...
- Patent number 10,090,207
- Issue date Oct 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiann Lih Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing (CMP) platform for local profile control
- Patent number 10,065,288
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiann Lih Wu
- B24 - GRINDING POLISHING
Information Patent Grant
CMP pad cleaning apparatus
- Patent number 9,138,861
- Issue date Sep 22, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiann Lih Wu
- B24 - GRINDING POLISHING
Information Patent Grant
CMP apparatus polishing head with concentric pressure zones
- Patent number 6,998,013
- Issue date Feb 14, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Tsan Jan
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
WAFER POLISHING HEAD, SYSTEM THEREOF, AND METHOD USING THE SAME
- Publication number 20230211452
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JAMES JENG-JYI HWANG
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SEMICONDUCTOR SUBSTRATE
- Publication number 20220384198
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- JAMES JENG-JYI HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING HEAD, SYSTEM THEREOF, AND METHOD USING THE SAME
- Publication number 20210220965
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JAMES JENG-JYI HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20210039223
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JAMES JENG-JYI HWANG
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20200039019
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JAMES JENG-JYI HWANG
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING (CMP) PLATFORM FOR LOCAL PROFILE CONTROL
- Publication number 20150352686
- Publication date Dec 10, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Jiann Lih Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PARTICLE REMOVAL
- Publication number 20150107619
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- Jiann Lih Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THROUGHPUT CMP PLATFORM
- Publication number 20140220863
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Jiann Lih Wu
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND DEVICE FOR CLEANING A BRUSH SURFACE HAVING A CONTAMINATION
- Publication number 20140196744
- Publication date Jul 17, 2014
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Jiann-Lih WU
- A46 - BRUSHWARE
Information Patent Application
MULTI-POINT CHEMICAL MECHANICAL POLISHING END POINT DETECTION SYSTE...
- Publication number 20140148008
- Publication date May 29, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiann Lih WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP Groove Depth and Conditioning Disk Monitoring
- Publication number 20130217306
- Publication date Aug 22, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Jiann Lih Wu
- B24 - GRINDING POLISHING
Information Patent Application
CMP Pad Cleaning Apparatus
- Publication number 20130210323
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Jiann Lih Wu
- B24 - GRINDING POLISHING
Information Patent Application
Multiple Zone Temperature Control for CMP
- Publication number 20130210173
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Jiann Lih Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP apparatus polishing head with concentric pressure zones
- Publication number 20040069406
- Publication date Apr 15, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Tsan Jan
- B24 - GRINDING POLISHING

Jiann-Lih WU

Person

Patents Grantslast 30 patents

Method for polishing semiconductor substrate

Device and methods for chemical mechanical polishing

Wafer polishing head, system thereof, and method using the same

Apparatus and methods for chemical mechanical polishing

High throughput CMP platform

Multi-point chemical mechanical polishing end point detection syste...

Chemical mechanical polishing (CMP) platform for local profile control

CMP pad cleaning apparatus

CMP apparatus polishing head with concentric pressure zones

Patents Applicationslast 30 patents

WAFER POLISHING HEAD, SYSTEM THEREOF, AND METHOD USING THE SAME

METHOD FOR POLISHING SEMICONDUCTOR SUBSTRATE

WAFER POLISHING HEAD, SYSTEM THEREOF, AND METHOD USING THE SAME

DEVICE AND METHODS FOR CHEMICAL MECHANICAL POLISHING

APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING

CHEMICAL MECHANICAL POLISHING (CMP) PLATFORM FOR LOCAL PROFILE CONTROL

WAFER PARTICLE REMOVAL

HIGH THROUGHPUT CMP PLATFORM

METHOD AND DEVICE FOR CLEANING A BRUSH SURFACE HAVING A CONTAMINATION

MULTI-POINT CHEMICAL MECHANICAL POLISHING END POINT DETECTION SYSTE...

CMP Groove Depth and Conditioning Disk Monitoring

CMP Pad Cleaning Apparatus

Multiple Zone Temperature Control for CMP

CMP apparatus polishing head with concentric pressure zones