Jianpeng WANG

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Xi'an, CN

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Patents Grantslast 30 patents

Information Patent Grant
Planar power module with spatially interleaved structure
- Patent number 11,532,557
- Issue date Dec 20, 2022
- Xi'an Jiaotong University
- Laili Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated package device for high-voltage silico...
- Patent number 11,158,609
- Issue date Oct 26, 2021
- Xi'an Jiaotong University
- Laili Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLANAR POWER MODULE WITH SPACIALLY INTERLEAVED STRUCTURE
- Publication number 20210202386
- Publication date Jul 1, 2021
- XI'AN JIAOTONG UNIVERSITY
- Laili WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED PACKAGE DEVICE FOR HIGH-VOLTAGE SILICO...
- Publication number 20200388595
- Publication date Dec 10, 2020
- XI'AN JIAOTONG UNIVERSITY
- Laili WANG
- H01 - BASIC ELECTRIC ELEMENTS