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Jianqiu Guo
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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Amorphous silicon-based scavenging and sealing EOT
Patent number
12,100,595
Issue date
Sep 24, 2024
Applied Materials, Inc.
Yong Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of tuning film properties of metal nitride using plasma
Patent number
11,646,226
Issue date
May 9, 2023
Applied Materials, Inc.
Wenyi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
In-situ tungsten deposition without barrier layer
Patent number
10,991,586
Issue date
Apr 27, 2021
Applied Materials, Inc.
Yong Wu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATION SOLUTION FOR NAND DEEP CONTACT GAP FILL
Publication number
20240282631
Publication date
Aug 22, 2024
Applied Materials, Inc.
Xi CEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods for Forming Low Resistivity Contacts
Publication number
20240105444
Publication date
Mar 28, 2024
Applied Materials, Inc.
Jiang LU
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHOD OF TUNING FILM PROPERTIES OF METAL NITRIDE USING PLASMA
Publication number
20230245925
Publication date
Aug 3, 2023
Applied Materials, Inc.
Wenyi LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Seamless Gapfill Of Metal Nitrides
Publication number
20220389568
Publication date
Dec 8, 2022
Applied Materials, Inc.
Subramanian Tamilmani
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Amorphous Silicon-Based Scavenging And Sealing EOT
Publication number
20220254640
Publication date
Aug 11, 2022
Applied Materials, Inc.
Yong Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF TUNING FILM PROPERTIES OF METAL NITRIDE USING PLASMA
Publication number
20210351071
Publication date
Nov 11, 2021
Applied Materials, Inc.
Wenyi LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IN-SITU TUNGSTEN DEPOSITION WITHOUT BARRIER LAYER
Publication number
20200243341
Publication date
Jul 30, 2020
Applied Materials, Inc.
Yong Wu
H01 - BASIC ELECTRIC ELEMENTS