Jiantao ZHENG

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Shenzhen, CN

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND CHIP PACKAGING METHOD
- Publication number 20230037617
- Publication date Feb 9, 2023
- Huawei Technologies Co., Ltd
- Jiantao ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED CHIP AND METHOD FOR MANUFACTURING PACKAGED CHIP
- Publication number 20220020659
- Publication date Jan 20, 2022
- Huawei Technologies Co., Ltd
- Jiantao ZHENG
- H01 - BASIC ELECTRIC ELEMENTS