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Patents Grantslast 30 patents

Information Patent Grant
Insulating paste-based conductive device and manufacturing method t...
- Patent number 12,009,334
- Issue date Jun 11, 2024
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microphone assembly
- Patent number 11,290,798
- Issue date Mar 29, 2022
- AAC Technologies Pte. Ltd.
- Guixia Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Speaker assembly
- Patent number 10,674,276
- Issue date Jun 2, 2020
- AAC Technologies Pte. Ltd.
- Zhichen Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
LED flip chip die-bond conductive adhesive structure and mounting m...
- Patent number 10,424,706
- Issue date Sep 24, 2019
- Jianwei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, mobile terminal, device, and readable storage medium for pr...
- Patent number 10,320,556
- Issue date Jun 11, 2019
- PING AN TECHNOLOGY (SHENZHEN) CO., LTD.
- Jianwei Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
INSULATING PASTE-BASED CONDUCTIVE DEVICE AND MANUFACTURING METHOD T...
- Publication number 20230307408
- Publication date Sep 28, 2023
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Speaker Assembly
- Publication number 20200053475
- Publication date Feb 13, 2020
- AAC Technologies Pte. Ltd.
- Zhichen Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROPHONE ASSEMBLY
- Publication number 20200045400
- Publication date Feb 6, 2020
- AAC Technologies Pte. Ltd.
- Guixia Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD, MOBILE TERMINAL, DEVICE, AND READABLE STORAGE MEDIUM FOR PR...
- Publication number 20180183575
- Publication date Jun 28, 2018
- Ping An Technology (Shenzhen) Co., LTD.
- Jianwei CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LED FLIP CHIP DIE-BOND CONDUCTIVE ADHESIVE STRUCTURE AND MOUNTING M...
- Publication number 20180019385
- Publication date Jan 18, 2018
- JIANWEI CHEN
- H01 - BASIC ELECTRIC ELEMENTS