Jianwen Xu

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) packages employing a capacitor-embedded, re...
- Patent number 12,218,041
- Issue date Feb 4, 2025
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising integrated devices coupled through a metallizati...
- Patent number 11,784,157
- Issue date Oct 10, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising mold for top side and sidewall prot...
- Patent number 10,141,202
- Issue date Nov 27, 2018
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level package without sidewall cracking
- Patent number 9,318,405
- Issue date Apr 19, 2016
- QUALCOMM Incorporated
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of packaging an electronic device
- Patent number 9,054,111
- Issue date Jun 9, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for quad flat no lead packaging
- Patent number 9,034,697
- Issue date May 19, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering relief method and semiconductor device employing same
- Patent number 8,841,168
- Issue date Sep 23, 2014
- QUALCOMM Incorporated
- Mark Wendell Schwarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Back side alignment structure and manufacturing method for three-di...
- Patent number 8,617,935
- Issue date Dec 31, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging an integrated circuit die using compression molding
- Patent number 8,609,471
- Issue date Dec 17, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering relief method and semiconductor device employing same
- Patent number 8,461,676
- Issue date Jun 11, 2013
- QUALCOMM Incorporated
- Mark Wendell Schwarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for releasing a microelectronic assembly from a carrier subs...
- Patent number 8,327,532
- Issue date Dec 11, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Packaging an integrated circuit die with backside metallization
- Patent number 8,236,609
- Issue date Aug 7, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device
- Patent number 8,216,918
- Issue date Jul 10, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Zhiwei Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of packaging an integrated circuit die
- Patent number 7,595,226
- Issue date Sep 29, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORT...
- Publication number 20240071993
- Publication date Feb 29, 2024
- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
- Publication number 20240072032
- Publication date Feb 29, 2024
- QUALCOMM Incorporated
- Yanmei SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...
- Publication number 20220392867
- Publication date Dec 8, 2022
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...
- Publication number 20220344250
- Publication date Oct 27, 2022
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND FAN OUT RECONSTITUTION PROCESS FOR MAKING T...
- Publication number 20150318229
- Publication date Nov 5, 2015
- QUALCOMM Incorporated
- Jianwen XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING MOLD FOR TOP SIDE AND SIDEWALL PROT...
- Publication number 20140339712
- Publication date Nov 20, 2014
- QUALCOMM Incorporated
- Reynante Tamunan Alvarado
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING RELIEF METHOD AND SEMICONDUCTOR DEVICE EMPLOYING SAME
- Publication number 20130244384
- Publication date Sep 19, 2013
- QUALCOMM Incorporated
- Mark Wendell Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Soldering Relief Method and Semiconductor Device Employing Same
- Publication number 20130062746
- Publication date Mar 14, 2013
- QUALCOMM Incorporated
- Mark Wendell Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE ALIGNMENT STRUCTURE AND MANUFACTURING METHOD FOR THREE-DI...
- Publication number 20130052777
- Publication date Feb 28, 2013
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR QUAD FLAT NO LEAD PACKAGING
- Publication number 20130015566
- Publication date Jan 17, 2013
- ZHIWEI GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20120021565
- Publication date Jan 26, 2012
- Zhiwei Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR RELEASING A MICROELECTRONIC ASSEMBLY FROM A C...
- Publication number 20110119910
- Publication date May 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE
- Publication number 20100252919
- Publication date Oct 7, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING AN INTEGRATED CIRCUIT DIE WITH BACKSIDE METALLIZATION
- Publication number 20100029045
- Publication date Feb 4, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING AN INTEGRATED CIRCUIT DIE USING COMPRESSION MOLDING
- Publication number 20090221114
- Publication date Sep 3, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Jianwen Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE
- Publication number 20090061564
- Publication date Mar 5, 2009
- FREESCALE SEMICONDUCTOR, INC.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit (IC) packages employing a capacitor-embedded, re...

Package comprising integrated devices coupled through a metallizati...

Semiconductor device comprising mold for top side and sidewall prot...

Wafer level package without sidewall cracking

Electronic device and method of packaging an electronic device

Apparatus and methods for quad flat no lead packaging

Soldering relief method and semiconductor device employing same

Back side alignment structure and manufacturing method for three-di...

Packaging an integrated circuit die using compression molding

Soldering relief method and semiconductor device employing same

Method for releasing a microelectronic assembly from a carrier subs...

Packaging an integrated circuit die with backside metallization

Method of forming a packaged semiconductor device

Method of packaging an integrated circuit die

Patents Applicationslast 30 patents

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN TWO METALLIZATION PORT...

PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...

PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A METALLIZATI...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, RE...

WAFER LEVEL PACKAGE AND FAN OUT RECONSTITUTION PROCESS FOR MAKING T...

SEMICONDUCTOR DEVICE COMPRISING MOLD FOR TOP SIDE AND SIDEWALL PROT...

SOLDERING RELIEF METHOD AND SEMICONDUCTOR DEVICE EMPLOYING SAME

Soldering Relief Method and Semiconductor Device Employing Same

BACK SIDE ALIGNMENT STRUCTURE AND MANUFACTURING METHOD FOR THREE-DI...

APPARATUS AND METHODS FOR QUAD FLAT NO LEAD PACKAGING

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE

METHOD AND SYSTEM FOR RELEASING A MICROELECTRONIC ASSEMBLY FROM A C...

ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE

PACKAGING AN INTEGRATED CIRCUIT DIE WITH BACKSIDE METALLIZATION

PACKAGING AN INTEGRATED CIRCUIT DIE USING COMPRESSION MOLDING

METHOD OF PACKAGING AN INTEGRATED CIRCUIT DIE