Jianxun Chen

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Method of copper plating filling
- Patent number 11,728,213
- Issue date Aug 15, 2023
- Shanghai Huali Integrated Circuit Corporation
- Junjie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,610,981
- Issue date Mar 21, 2023
- Shanghai Huali Integrated Circuit Corporation
- Changhung Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,581,225
- Issue date Feb 14, 2023
- Shanghai Huali Integrated Circuit Corporation
- Changhung Kung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Manufacturing Integrated Metal Resistance Layer
- Publication number 20230088046
- Publication date Mar 23, 2023
- Shanghai Huali Integrated Circuit Corporation
- Changhung Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Device
- Publication number 20210408268
- Publication date Dec 30, 2021
- Shanghai Huali Integrated Circuit Corporation
- Changhung Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Semiconductor Device
- Publication number 20210375689
- Publication date Dec 2, 2021
- Shanghai Huali Integrated Circuit Corporation
- Changhung Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COPPER PLATING FILLING
- Publication number 20210057274
- Publication date Feb 25, 2021
- Shanghai Huali Integrated Circuit Corporation
- Junjie Wang
- H01 - BASIC ELECTRIC ELEMENTS