Jianyong Xie

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
EMIB architecture with dedicated metal layers for improving power d...
- Patent number 12,218,063
- Issue date Feb 4, 2025
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with chiplets coupled to a memory device
- Patent number 12,205,924
- Issue date Jan 21, 2025
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 12,062,616
- Issue date Aug 13, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package design scheme for enabling high-speed low-loss signaling an...
- Patent number 12,057,413
- Issue date Aug 6, 2024
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 12,046,568
- Issue date Jul 23, 2024
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-filled trench isolation of vias
- Patent number 11,887,932
- Issue date Jan 30, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,837,549
- Issue date Dec 5, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,817,391
- Issue date Nov 14, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 11,728,294
- Issue date Aug 15, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal pitch translation using embedded bridge dies
- Patent number 11,694,952
- Issue date Jul 4, 2023
- Intel Corporation
- Sujit Sharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect hub for dies
- Patent number 11,621,223
- Issue date Apr 4, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,621,227
- Issue date Apr 4, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with chiplets coupled to a memory device
- Patent number 11,610,862
- Issue date Mar 21, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimization of insertion loss variation in through-silicon vias (T...
- Patent number 11,545,416
- Issue date Jan 3, 2023
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel die complex with integrated discrete passive components
- Patent number 11,462,521
- Issue date Oct 4, 2022
- Intel Corporation
- Andrew P. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture and processes to enable high capacity memory packages...
- Patent number 11,456,281
- Issue date Sep 27, 2022
- Intel Corporation
- Yí Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded very high density (VHD) layer
- Patent number 11,387,187
- Issue date Jul 12, 2022
- Intel Corporation
- Andrew Paul Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-filled trench isolation of vias
- Patent number 11,296,031
- Issue date Apr 5, 2022
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal pitch translation using embedded bridge dies
- Patent number 11,276,635
- Issue date Mar 15, 2022
- Intel Corporation
- Sujit Sharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-inductance current paths for on-package power distributions and...
- Patent number 11,222,837
- Issue date Jan 11, 2022
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,222,848
- Issue date Jan 11, 2022
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 11,195,805
- Issue date Dec 7, 2021
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing carrier
- Patent number 11,114,394
- Issue date Sep 7, 2021
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with through bridge die connections
- Patent number 10,950,550
- Issue date Mar 16, 2021
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-delivery methods for embedded multi-die interconnect bridges...
- Patent number 10,847,467
- Issue date Nov 24, 2020
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-inductance current paths for on-package power distributions and...
- Patent number 10,651,117
- Issue date May 12, 2020
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-delivery methods for embedded multi-die interconnect bridges...
- Patent number 10,490,503
- Issue date Nov 26, 2019
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE
- Publication number 20250112209
- Publication date Apr 3, 2025
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20240355745
- Publication date Oct 24, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20240321785
- Publication date Sep 26, 2024
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20240030143
- Publication date Jan 25, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER SELECTION FOR ROUTING HIGH-SPEED SIGNALS IN SUBSTRATES
- Publication number 20240006286
- Publication date Jan 4, 2024
- Intel Corporation
- Arghya Sain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20230343731
- Publication date Oct 26, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE C...
- Publication number 20230299044
- Publication date Sep 21, 2023
- Intel Corporation
- Andrew P. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20230238332
- Publication date Jul 27, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA LOW LOSS AND HIGH-DENSITY ROUTING BETWEEN CORES
- Publication number 20230207406
- Publication date Jun 29, 2023
- Intel Corporation
- Arghya SAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE LAYER AND MULTILAYER MAGNETIC INDUCTORS BETWEEN SUBSTRATE CORES
- Publication number 20230207494
- Publication date Jun 29, 2023
- Jianyong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE
- Publication number 20230197682
- Publication date Jun 22, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20230138168
- Publication date May 4, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE
- Publication number 20230100576
- Publication date Mar 30, 2023
- Intel Corporation
- Andrew COLLINS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC-FILLED TRENCH ISOLATION OF VIAS
- Publication number 20220270974
- Publication date Aug 25, 2022
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES
- Publication number 20220157706
- Publication date May 19, 2022
- Intel Corporation
- Sujit SHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20220093516
- Publication date Mar 24, 2022
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20220059476
- Publication date Feb 24, 2022
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...
- Publication number 20210280518
- Publication date Sep 9, 2021
- Intel Corporation
- Jianyong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING CARRIER
- Publication number 20210043588
- Publication date Feb 11, 2021
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATELESS DOUBLE-SIDED EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
- Publication number 20200395300
- Publication date Dec 17, 2020
- Intel Corporation
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-FILLED TRENCH ISOLATION OF VIAS
- Publication number 20200388572
- Publication date Dec 10, 2020
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES
- Publication number 20200381350
- Publication date Dec 3, 2020
- Intel Corporation
- Sujit SHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT HUB FOR DIES
- Publication number 20200373235
- Publication date Nov 26, 2020
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DESIGN SCHEME FOR ENABLING HIGH-SPEED LOW-LOSS SIGNALING AN...
- Publication number 20200343202
- Publication date Oct 29, 2020
- Intel Corporation
- Lijiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIMIZATION OF INSERTION LOSS VARIATION IN THROUGH-SILICON VIAS (T...
- Publication number 20200279793
- Publication date Sep 3, 2020
- Intel Corporation
- Jianyong XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THROUGH BRIDGE DIE CONNECTIONS
- Publication number 20200243448
- Publication date Jul 30, 2020
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-INDUCTANCE CURRENT PATHS FOR ON-PACKAGE POWER DISTRIBUTIONS AND...
- Publication number 20200235048
- Publication date Jul 23, 2020
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20200235053
- Publication date Jul 23, 2020
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRA-SEMICONDUCTOR DIE COMMUNICATION VIA WAVEGUIDE IN A MULTI-DIE...
- Publication number 20200203293
- Publication date Jun 25, 2020
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE
- Publication number 20200105718
- Publication date Apr 2, 2020
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS

Jianyong Xie

Person

Patents Grantslast 30 patents

EMIB architecture with dedicated metal layers for improving power d...

Semiconductor packages with chiplets coupled to a memory device

Power delivery for embedded bridge die utilizing trench structures

Package design scheme for enabling high-speed low-loss signaling an...

Capacitor die embedded in package substrate for providing capacitan...

Dielectric-filled trench isolation of vias

Power delivery for embedded bridge die utilizing trench structures

Power delivery for embedded bridge die utilizing trench structures

Capacitor die embedded in package substrate for providing capacitan...

Horizontal pitch translation using embedded bridge dies

Interconnect hub for dies

Power delivery for embedded bridge die utilizing trench structures

Semiconductor packages with chiplets coupled to a memory device

Minimization of insertion loss variation in through-silicon vias (T...

Multilevel die complex with integrated discrete passive components

Architecture and processes to enable high capacity memory packages...

Embedded very high density (VHD) layer

Dielectric-filled trench isolation of vias

Horizontal pitch translation using embedded bridge dies

Low-inductance current paths for on-package power distributions and...

Power delivery for embedded bridge die utilizing trench structures

Capacitor die embedded in package substrate for providing capacitan...

Signal routing carrier

Semiconductor package with through bridge die connections

Power-delivery methods for embedded multi-die interconnect bridges...

Low-inductance current paths for on-package power distributions and...

Power-delivery methods for embedded multi-die interconnect bridges...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

LAYER SELECTION FOR ROUTING HIGH-SPEED SIGNALS IN SUBSTRATES

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...

PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE C...

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

ULTRA LOW LOSS AND HIGH-DENSITY ROUTING BETWEEN CORES

SINGLE LAYER AND MULTILAYER MAGNETIC INDUCTORS BETWEEN SUBSTRATE CORES

SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE

DIELECTRIC-FILLED TRENCH ISOLATION OF VIAS

HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...

EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER D...

SIGNAL ROUTING CARRIER

SUBSTRATELESS DOUBLE-SIDED EMBEDDED MULTI-DIE INTERCONNECT BRIDGE

DIELECTRIC-FILLED TRENCH ISOLATION OF VIAS

HORIZONTAL PITCH TRANSLATION USING EMBEDDED BRIDGE DIES

INTERCONNECT HUB FOR DIES

PACKAGE DESIGN SCHEME FOR ENABLING HIGH-SPEED LOW-LOSS SIGNALING AN...

MINIMIZATION OF INSERTION LOSS VARIATION IN THROUGH-SILICON VIAS (T...

SEMICONDUCTOR PACKAGE WITH THROUGH BRIDGE DIE CONNECTIONS

LOW-INDUCTANCE CURRENT PATHS FOR ON-PACKAGE POWER DISTRIBUTIONS AND...

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES

INTRA-SEMICONDUCTOR DIE COMMUNICATION VIA WAVEGUIDE IN A MULTI-DIE...

SEMICONDUCTOR PACKAGES WITH CHIPLETS COUPLED TO A MEMORY DEVICE