Jiaqi Wu

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Chandler, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...
- Publication number 20240222304
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND O...
- Publication number 20230415253
- Publication date Dec 28, 2023
- Intel Corporation
- Sangeon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT INJECTION FILLING DEVICE, SYSTEM, AND METHOD FOR LIQUID META...
- Publication number 20230317476
- Publication date Oct 5, 2023
- Intel Corporation
- Sangeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING FOR LIQUID METAL SOCKET INTERCONNECTS
- Publication number 20230299024
- Publication date Sep 21, 2023
- Intel Corporation
- Jiaqi Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR