Jiasheng Wang

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Beijing, CN

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Patents Grantslast 30 patents

Information Patent Grant
3D package device of photonic integrated chip matching circuit
- Patent number 9,059,516
- Issue date Jun 16, 2015
- Institute of Semiconductors, Chinese Academy of Sciences
- Ninghua Zhu
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
3D PACKAGE DEVICE OF PHOTONIC INTEGRATED CHIP MATCHING CIRCUIT
- Publication number 20140078011
- Publication date Mar 20, 2014
- Institute of Semiconductors, Chinese Academy of Sciences
- Ninghua Zhu
- G02 - OPTICS