Jicheng Yang

Person

North Andover, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microphone system with a stop member
- Patent number 9,338,559
- Issue date May 10, 2016
- Invensense, Inc.
- Jicheng Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microphone system with offset apertures
- Patent number 9,258,634
- Issue date Feb 9, 2016
- Invensense, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for packaging
- Patent number 9,142,470
- Issue date Sep 22, 2015
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for packaging MEMS microphone devices
- Patent number 9,002,040
- Issue date Apr 7, 2015
- Invensense, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Air-release features in cavity packages
- Patent number 8,853,839
- Issue date Oct 7, 2014
- Analog Devices, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged integrated device die between an external and internal hou...
- Patent number 8,779,535
- Issue date Jul 15, 2014
- Analog Devices, Inc.
- Thomas M. Goida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Packages and methods for packaging using a lid having multiple cond...
- Patent number 8,723,308
- Issue date May 13, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for packaging MEMS microphone devices
- Patent number 8,577,063
- Issue date Nov 5, 2013
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packages and methods for packaging MEMS microphone devices
- Patent number 8,447,057
- Issue date May 21, 2013
- Analog Devices, Inc.
- Thomas Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20140332947
- Publication date Nov 13, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone System with a Stop Member
- Publication number 20140307909
- Publication date Oct 16, 2014
- InvenSense, Inc.
- Jicheng Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES
- Publication number 20140225203
- Publication date Aug 14, 2014
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20130241045
- Publication date Sep 19, 2013
- Analog Devices, Inc.
- Thomas M. Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microphone System with Offset Apertures
- Publication number 20130195284
- Publication date Aug 1, 2013
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR AIR-RELEASE IN CAVITY PACKAGES
- Publication number 20130093031
- Publication date Apr 18, 2013
- Analog Devices, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES
- Publication number 20120237073
- Publication date Sep 20, 2012
- Analog Devices, Inc.
- Thomas Goida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING
- Publication number 20120126347
- Publication date May 24, 2012
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES
- Publication number 20110198714
- Publication date Aug 18, 2011
- Analog Devices, Inc.
- Jicheng Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jicheng Yang

Person

Patents Grantslast 30 patents

Microphone system with a stop member

Microphone system with offset apertures

Packages and methods for packaging

Packages and methods for packaging MEMS microphone devices

Air-release features in cavity packages

Packaged integrated device die between an external and internal hou...

Packages and methods for packaging using a lid having multiple cond...

Packages and methods for packaging MEMS microphone devices

Packages and methods for packaging MEMS microphone devices

Patents Applicationslast 30 patents

PACKAGES AND METHODS FOR PACKAGING

Microphone System with a Stop Member

PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES

PACKAGES AND METHODS FOR PACKAGING

Microphone System with Offset Apertures

SYSTEMS AND METHODS FOR AIR-RELEASE IN CAVITY PACKAGES

PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES

PACKAGES AND METHODS FOR PACKAGING

PACKAGES AND METHODS FOR PACKAGING MEMS MICROPHONE DEVICES