Jichul Kim

Person

Hwasung, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,600,608
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,985,152
- Issue date Apr 20, 2021
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,937,771
- Issue date Mar 2, 2021
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooling packages and thermal management methods thereof
- Patent number 10,658,266
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Semiconductor package
- Patent number 10,510,737
- Issue date Dec 17, 2019
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having redistribution substrate
- Patent number 10,347,611
- Issue date Jul 9, 2019
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface temperature management method of mobile device and memory t...
- Patent number 10,198,049
- Issue date Feb 5, 2019
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged semiconductor chips having heat dissipation layers and gro...
- Patent number 9,978,661
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit for estimating power of at least one node using...
- Patent number 9,903,764
- Issue date Feb 27, 2018
- Samsung Electronics Co., Ltd.
- Kyungsoo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and semiconductor device including the same
- Patent number 9,679,874
- Issue date Jun 13, 2017
- Samsung Electronics Co., Ltd.
- Jin-Kwon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooling packages and thermal management methods thereof
- Patent number 9,671,141
- Issue date Jun 6, 2017
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Semiconductor package and method of estimating surface temperature...
- Patent number 9,651,431
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface temperature management method of mobile device and memory t...
- Patent number 9,606,591
- Issue date Mar 28, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package-on-package device
- Patent number 9,583,430
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Kyol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including heat exhaust part
- Patent number 9,391,009
- Issue date Jul 12, 2016
- Samsung Electronics Co., Ltd.
- Eon Soo Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooling packages and thermal management methods thereof
- Patent number 9,228,763
- Issue date Jan 5, 2016
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Chip-on-film packages and device assemblies including the same
- Patent number 9,030,826
- Issue date May 12, 2015
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including heat diffusion vias and interconne...
- Patent number 9,013,031
- Issue date Apr 21, 2015
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display devices
- Patent number 8,988,645
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Jichul Kim
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210202462
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- JICHUL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190348407
- Publication date Nov 14, 2019
- Samsung Electronics Co., Ltd.
- JICHUL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20190287951
- Publication date Sep 19, 2019
- Samsung Electronics Co., Ltd.
- JICHUL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180301443
- Publication date Oct 18, 2018
- Samsung Electronics Co., Ltd.
- JICHUL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20180269126
- Publication date Sep 20, 2018
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF
- Publication number 20170229373
- Publication date Aug 10, 2017
- Jae Choon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20170207205
- Publication date Jul 20, 2017
- Jichul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...
- Publication number 20170185119
- Publication date Jun 29, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20170047264
- Publication date Feb 16, 2017
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20160133605
- Publication date May 12, 2016
- Samsung Electronics Co., Ltd.
- Jin-Kwon BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FOR ESTIMATING POWER OF AT LEAST ONE NODE USING...
- Publication number 20160092617
- Publication date Mar 31, 2016
- Kyungsoo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF
- Publication number 20160084542
- Publication date Mar 24, 2016
- JAE CHOON KIM
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE
- Publication number 20150115467
- Publication date Apr 30, 2015
- Kyol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING HEAT DIFFUSION VIAS AND INTERCONNE...
- Publication number 20140367860
- Publication date Dec 18, 2014
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ESTIMATING SURFACE TEMPERATURE...
- Publication number 20140247859
- Publication date Sep 4, 2014
- Jae Choon KIM
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF
- Publication number 20130166093
- Publication date Jun 27, 2013
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF
- Publication number 20130139524
- Publication date Jun 6, 2013
- Jae Choon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...
- Publication number 20130091348
- Publication date Apr 11, 2013
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICES
- Publication number 20130057559
- Publication date Mar 7, 2013
- Samsung Electronics Co., Ltd.
- Jichul KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP-ON-FILM PACKAGES AND DEVICE ASSEMBLIES INCLUDING THE SAME
- Publication number 20130021768
- Publication date Jan 24, 2013
- Jichul KIM
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package

Semiconductor packages

Thermoelectric cooling packages and thermal management methods thereof

Semiconductor package

Semiconductor packages having redistribution substrate

Surface temperature management method of mobile device and memory t...

Packaged semiconductor chips having heat dissipation layers and gro...

Integrated circuit for estimating power of at least one node using...

Semiconductor package and semiconductor device including the same

Thermoelectric cooling packages and thermal management methods thereof

Semiconductor package and method of estimating surface temperature...

Surface temperature management method of mobile device and memory t...

Package-on-package device

Semiconductor packages including heat exhaust part

Thermoelectric cooling packages and thermal management methods thereof

Chip-on-film packages and device assemblies including the same

Semiconductor packages including heat diffusion vias and interconne...

Display devices

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF

SEMICONDUCTOR PACKAGES

SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

INTEGRATED CIRCUIT FOR ESTIMATING POWER OF AT LEAST ONE NODE USING...

THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF

PACKAGE-ON-PACKAGE DEVICE

SEMICONDUCTOR PACKAGES INCLUDING HEAT DIFFUSION VIAS AND INTERCONNE...

SEMICONDUCTOR PACKAGE AND METHOD OF ESTIMATING SURFACE TEMPERATURE...

ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF

THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF

SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...

DISPLAY DEVICES

CHIP-ON-FILM PACKAGES AND DEVICE ASSEMBLIES INCLUDING THE SAME