Jick M. Yu

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal to ILD adhesion improvement by reactive sputtering
- Patent number 6,746,727
- Issue date Jun 8, 2004
- Intel Corporation
- Jick Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration of annealing capability into metal deposition or CMP tool
- Patent number 6,730,598
- Issue date May 4, 2004
- Intel Corporation
- Jick M. Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Two chamber metal reflow process
- Patent number 6,365,514
- Issue date Apr 2, 2002
- Intel Corporation
- Jick Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature aluminum alloy plug technology
- Patent number 5,804,251
- Issue date Sep 8, 1998
- Intel Corporation
- Jick M. Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductor fill reflow with intermetallic compound wetting layer for...
- Patent number 5,693,564
- Issue date Dec 2, 1997
- Intel Corporation
- Jick M. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS rear end processing
- Patent number 4,620,986
- Issue date Nov 4, 1986
- Intel Corporation
- Leopoldo D. Yau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS rear end processing
- Patent number 4,587,138
- Issue date May 6, 1986
- Intel Corporation
- Leopoldo D. Yau
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integration of annealing capability into metal deposition or CMP tool
- Publication number 20040229459
- Publication date Nov 18, 2004
- Jick M. Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Metal to ILD adhesion improvement by reactive sputtering

Integration of annealing capability into metal deposition or CMP tool

Two chamber metal reflow process

Low temperature aluminum alloy plug technology

Conductor fill reflow with intermetallic compound wetting layer for...

MOS rear end processing

MOS rear end processing

Patents Applicationslast 30 patents

Integration of annealing capability into metal deposition or CMP tool