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Jicun Lu
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Rancho Cordova, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Electronic packages with dice landed on wire bonds
Patent number
7,166,924
Issue date
Jan 23, 2007
Intel Corporation
Jicun Lu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Electronic packages with dice landed on wire bonds
Publication number
20060038273
Publication date
Feb 23, 2006
Jicun Lu
H01 - BASIC ELECTRIC ELEMENTS