Jie CHANG

Person

Suzhou SIP, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with substrate recess for conductive-bonding component
- Patent number 11,776,871
- Issue date Oct 3, 2023
- Semiconductor Components Industries, LLC
- Leo Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module semiconductor package with multiple submodules
- Patent number 11,127,651
- Issue date Sep 21, 2021
- Semiconductor Components Industries, LLC
- Jie Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Press-fit power module and related methods
- Patent number 10,804,626
- Issue date Oct 13, 2020
- Semiconductor Components Industries, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 10,566,713
- Issue date Feb 18, 2020
- Semiconductor Components Industries, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module semiconductor package with multiple submodules
- Patent number 10,553,517
- Issue date Feb 4, 2020
- Semiconductor Components Industries, LLC
- Jie Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
FULL AG SINTER DISCRETE PREMIUM PACKAGE
- Publication number 20240312855
- Publication date Sep 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- XiaoYing YUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DUAL PADS FOR A CIRCUIT
- Publication number 20240304529
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20240030093
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240021487
- Publication date Jan 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT
- Publication number 20220189848
- Publication date Jun 16, 2022
- Semiconductor Components Industries, LLC
- Leo GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT POWER MODULE AND RELATED METHODS
- Publication number 20210021065
- Publication date Jan 21, 2021
- Semiconductor Components Industries, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES
- Publication number 20200194336
- Publication date Jun 18, 2020
- Semiconductor Components Industries, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESS-FIT POWER MODULE AND RELATED METHODS
- Publication number 20200144744
- Publication date May 7, 2020
- Semiconductor Components Industries, LLC
- Jie CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES
- Publication number 20190221493
- Publication date Jul 18, 2019
- Semiconductor Components Industries, LLC
- Jie CHANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRESS-FIT POWER MODULE AND RELATED METHODS
- Publication number 20190214749
- Publication date Jul 11, 2019
- Semiconductor Components Industries, LLC
- Jie CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Press-fit power module and related methods

Module with substrate recess for conductive-bonding component

High power module semiconductor package with multiple submodules

Press-fit power module and related methods

Press-fit power module and related methods

High power module semiconductor package with multiple submodules

Patents Applicationslast 30 patents

FULL AG SINTER DISCRETE PREMIUM PACKAGE

DISCRETE DUAL PADS FOR A CIRCUIT

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

SEMICONDUCTOR DEVICE PACKAGE

MODULE WITH SUBSTRATE RECESS FOR CONDUCTIVE-BONDING COMPONENT

PRESS-FIT POWER MODULE AND RELATED METHODS

HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES

PRESS-FIT POWER MODULE AND RELATED METHODS

HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES

PRESS-FIT POWER MODULE AND RELATED METHODS