Jie CHEN

Person

Denton, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with shunt and patterned metal trace
- Patent number 12,211,800
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel gate driver package with grounded shield metal
- Patent number 12,191,259
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 12,165,989
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multiple exposed pads
- Patent number 11,735,506
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 11,621,232
- Issue date Apr 4, 2023
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 11,557,722
- Issue date Jan 17, 2023
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hall-effect sensor package with added current path
- Patent number 10,892,405
- Issue date Jan 12, 2021
- Texas Instruments Incorporated
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 10,262,957
- Issue date Apr 16, 2019
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,941,228
- Issue date Apr 10, 2018
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 9,666,553
- Issue date May 30, 2017
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20240429216
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
- Publication number 20240304517
- Publication date Sep 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD
- Publication number 20240178155
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCON...
- Publication number 20240178154
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...
- Publication number 20240120297
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
- Publication number 20240072025
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rajen M. Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hermetic Package Cooling Using Silver Tubes with Getter Absorption...
- Publication number 20240006267
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
- Publication number 20230395472
- Publication date Dec 7, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE FOR SEMICONDUCTOR DEVICES
- Publication number 20230317581
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20230245982
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHANNEL GATE DRIVER PACKAGE WITH GROUNDED SHIELD METAL
- Publication number 20230215811
- Publication date Jul 6, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVES TO FACILITATE MOLD COMPOUND FLOW
- Publication number 20230101847
- Publication date Mar 30, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Chittranjan Mohan GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTILAYER PACKAGE SUBSTRATE
- Publication number 20230021179
- Publication date Jan 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
- Publication number 20220384353
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20220352087
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for High Power GaN Module
- Publication number 20210175195
- Publication date Jun 10, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH
- Publication number 20210159403
- Publication date May 27, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH
- Publication number 20200357987
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Ming Li
- G01 - MEASURING TESTING
Information Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
- Publication number 20190355652
- Publication date Nov 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20180301428
- Publication date Oct 18, 2018
- Rajen Manicon Murugan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20170229408
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20150364816
- Publication date Dec 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon MURUGAN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package with shunt and patterned metal trace

Multi-channel gate driver package with grounded shield metal

Semiconductor package with electromagnetic interference shielding

Packages with multiple exposed pads

Semiconductor package with electromagnetic interference shielding

Hall-effect sensor package with added current path

Hall-effect sensor package with added current path

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

Millimeter wave integrated circuit with ball grid array package inc...

Patents Applicationslast 30 patents

EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

MULTILEVEL PACKAGE SUBSTRATE WITH BOX SHIELD

ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCON...

MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...

Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...

Hermetic Package Cooling Using Silver Tubes with Getter Absorption...

PACKAGES WITH MULTIPLE EXPOSED PADS

FLIP CHIP PACKAGE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

MULTI-CHANNEL GATE DRIVER PACKAGE WITH GROUNDED SHIELD METAL

PASSIVES TO FACILITATE MOLD COMPOUND FLOW

SEMICONDUCTOR DEVICE WITH A MULTILAYER PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE

SEMICONDUCTOR PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING

Interconnect Structure for High Power GaN Module

HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH

HALL-EFFECT SENSOR PACKAGE WITH ADDED CURRENT PATH

PACKAGES WITH MULTIPLE EXPOSED PADS

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...