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Jie Chen
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Saratoga, CA, US
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last 30 patents
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Patent Grant
Multi-component doping of copper seed layer
Patent number
7,749,361
Issue date
Jul 6, 2010
Applied Materials, Inc.
Jie Chen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
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Patent Application
Multi-component doping of copper seed layer
Publication number
20070278089
Publication date
Dec 6, 2007
Applied Materials, Inc.
Jie Chen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...