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Jie FU
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San Diego, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Air cavity mold
Patent number
10,490,472
Issue date
Nov 26, 2019
QUALCOMM Incorporated
Jie Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power amplifier with RF structure
Patent number
10,431,511
Issue date
Oct 1, 2019
QUALCOMM Incorporated
Daeik Daniel Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waveguide along shielded side wall
Patent number
10,418,333
Issue date
Sep 17, 2019
QUALCOMM Incorporated
Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Backside drill embedded die substrate
Patent number
10,325,855
Issue date
Jun 18, 2019
QUALCOMM Incorporated
Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded stacked substrate apparatus and method of fabricating
Patent number
10,325,859
Issue date
Jun 18, 2019
QUALCOMM Incorporated
Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assembly and method of making same
Patent number
10,319,694
Issue date
Jun 11, 2019
QUALCOMM Incorporated
Daniel Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reinforced wafer level package comprising a core layer for reducing...
Patent number
9,806,063
Issue date
Oct 31, 2017
QUALCOMM Incorporated
Chin-Kwan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive post protection for integrated circuit packages
Patent number
9,768,108
Issue date
Sep 19, 2017
QUALCOMM Incorporated
Jie Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate comprising improved via pad placement in bump area
Patent number
9,466,578
Issue date
Oct 11, 2016
QUALCOMM Incorporated
Jie Fu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
AIR CAVITY MOLD
Publication number
20190067141
Publication date
Feb 28, 2019
QUALCOMM Incorporated
Jie FU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFIER WITH RF STRUCTURE
Publication number
20180316319
Publication date
Nov 1, 2018
QUALCOMM Incorporated
Daeik Daniel KIM
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
WIRE-BOND CAGE IN CONFORMAL SHIELDING
Publication number
20180228016
Publication date
Aug 9, 2018
QUALCOMM Incorporated
Daeik Daniel KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR ASSEMBLY AND METHOD OF MAKING SAME
Publication number
20180047687
Publication date
Feb 15, 2018
QUALCOMM Incorporated
Daeik Daniel KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BACKSIDE DRILL EMBEDDED DIE SUBSTRATE
Publication number
20170271266
Publication date
Sep 21, 2017
QUALCOMM Incorporated
Daeik Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON-PACKAGE CONNECTOR
Publication number
20170084523
Publication date
Mar 23, 2017
QUALCOMM Incorporated
Jie FU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...
Publication number
20160322332
Publication date
Nov 3, 2016
QUALCOMM Incorporated
Chin-Kwan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE POST PROTECTION FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20160247754
Publication date
Aug 25, 2016
QUALCOMM Incorporated
Jie FU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STR...
Publication number
20160148864
Publication date
May 26, 2016
QUALCOMM Incorporated
Jie Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE COMPRISING IMPROVED VIA PAD PLACEMENT IN BUMP AREA
Publication number
20150179590
Publication date
Jun 25, 2015
QUALCOMM Incorporated
Jie Fu
H01 - BASIC ELECTRIC ELEMENTS