Jie-Hua Zhao

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit device with at least partial packaging and method for forming
- Patent number 8,072,062
- Issue date Dec 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical integrity evaluation of low-k devices with bump shear
- Patent number 7,622,309
- Issue date Nov 24, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Peng Su
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming crack arrest features in embedded device build-up...
- Patent number 7,553,753
- Issue date Jun 30, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device with at least partial packaging and method for forming
- Patent number 7,361,987
- Issue date Apr 22, 2008
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having structural support for a flip-chip interc...
- Patent number 7,247,552
- Issue date Jul 24, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device with at least partial packaging, exposed active surf...
- Patent number 6,921,975
- Issue date Jul 26, 2005
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device with at least partial packaging and method for forming
- Patent number 6,838,776
- Issue date Jan 4, 2005
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electromigration-Resistant Flip-Chip Solder Joints
- Publication number 20100219528
- Publication date Sep 2, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Jie-Hua ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromigration-Resistant Flip-Chip Solder Joints
- Publication number 20080251927
- Publication date Oct 16, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE WITH AT LEAST PARTIAL PACKAGING AND METHOD FOR FORMING
- Publication number 20080142960
- Publication date Jun 19, 2008
- FREESCALE SEMICONDUCTOR, INC.
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-IMPROVED FLIP-CHIP SEMICONDUCTOR DEVICE HAVING HALF-ETCHED L...
- Publication number 20080135990
- Publication date Jun 12, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Anthony L. Coyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe finger design to ensure lead-locking for enhanced fatigue...
- Publication number 20080122049
- Publication date May 29, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CRACK ARREST FEATURES IN EMBEDDED DEVICE BUILD-UP...
- Publication number 20080057696
- Publication date Mar 6, 2008
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanical integrity evaluation of low-k devices with bump shear
- Publication number 20060292711
- Publication date Dec 28, 2006
- Peng Su
- G01 - MEASURING TESTING
Information Patent Application
Integrated circuit having structural support for a flip-chip interc...
- Publication number 20060154470
- Publication date Jul 13, 2006
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit device with at least partial packaging and method for forming
- Publication number 20060012036
- Publication date Jan 19, 2006
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit device with at least partial packaging and method for forming
- Publication number 20040207077
- Publication date Oct 21, 2004
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit device with at least partial packaging and method for forming
- Publication number 20040207068
- Publication date Oct 21, 2004
- George R. Leal
- H01 - BASIC ELECTRIC ELEMENTS

Jie-Hua Zhao

Person

Patents Grantslast 30 patents

Circuit device with at least partial packaging and method for forming

Mechanical integrity evaluation of low-k devices with bump shear

Method of forming crack arrest features in embedded device build-up...

Circuit device with at least partial packaging and method for forming

Integrated circuit having structural support for a flip-chip interc...

Circuit device with at least partial packaging, exposed active surf...

Circuit device with at least partial packaging and method for forming

Patents Applicationslast 30 patents

Electromigration-Resistant Flip-Chip Solder Joints

Electromigration-Resistant Flip-Chip Solder Joints

CIRCUIT DEVICE WITH AT LEAST PARTIAL PACKAGING AND METHOD FOR FORMING

STRESS-IMPROVED FLIP-CHIP SEMICONDUCTOR DEVICE HAVING HALF-ETCHED L...

Leadframe finger design to ensure lead-locking for enhanced fatigue...

METHOD OF FORMING CRACK ARREST FEATURES IN EMBEDDED DEVICE BUILD-UP...

Mechanical integrity evaluation of low-k devices with bump shear

Integrated circuit having structural support for a flip-chip interc...

Circuit device with at least partial packaging and method for forming

Circuit device with at least partial packaging and method for forming

Circuit device with at least partial packaging and method for forming