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Jie-Hung Chiou
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Shanghai, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Method of fabricating chip package structure
Patent number
8,105,881
Issue date
Jan 31, 2012
ChipMOS Technologies (Bermuda) Ltd.
Jie-Hung Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating chip package
Patent number
8,088,650
Issue date
Jan 3, 2012
Chipmos Technologies (Bermuda) Ltd.
Yong-Chao Qiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure and fabricating method thereof
Patent number
8,039,946
Issue date
Oct 18, 2011
ChipMOS Technologies (Shanghai) Ltd.
Hua Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating chip package structure
Patent number
7,741,149
Issue date
Jun 22, 2010
Chipmos Technologies (Bermuda) Ltd.
Yong-Chao Qiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package structure
Patent number
7,683,462
Issue date
Mar 23, 2010
ChipMOS Technologies (Bermuda) Ltd.
Jie-Hung Chiou
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
Publication number
20100078801
Publication date
Apr 1, 2010
CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
Hua Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
Publication number
20100078802
Publication date
Apr 1, 2010
CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
Hua Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING CHIP PACKAGE
Publication number
20090280603
Publication date
Nov 12, 2009
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Yong-Chao Qiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING CHIP PACKAGE STRUCTURE
Publication number
20090197374
Publication date
Aug 6, 2009
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Yong-Chao Qiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE
Publication number
20080224284
Publication date
Sep 18, 2008
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Yan-Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20080224277
Publication date
Sep 18, 2008
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Yong-Chao Qiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20080191324
Publication date
Aug 14, 2008
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Yong-Chao Qiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING CHIP PACKAGE STRUCTURE
Publication number
20080188039
Publication date
Aug 7, 2008
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Jie-Hung Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20080185697
Publication date
Aug 7, 2008
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Jie-Hung Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE
Publication number
20080157304
Publication date
Jul 3, 2008
CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
Jie-Hung Chiou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
Publication number
20080012106
Publication date
Jan 17, 2008
CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
Hua Pan
H01 - BASIC ELECTRIC ELEMENTS