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Patents Grants
last 30 patents
Information
Patent Grant
Bonding contacts having capping layer and method for forming the same
Patent number
11,715,718
Issue date
Aug 1, 2023
Yangtze Memory Technologies Co., Ltd.
Jie Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding contacts having capping layer and method for forming the same
Patent number
11,177,231
Issue date
Nov 16, 2021
Yangtze Memory Technologies Co., Ltd.
Jie Pan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR FABRICATION METHOD WITH IMPROVED DEPOSITION QUALITY A...
Publication number
20240038668
Publication date
Feb 1, 2024
Yangtze Memory Technologies Co., Ltd.
Rui SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME
Publication number
20230317665
Publication date
Oct 5, 2023
Yangtze Memory Technologies Co., Ltd.
Jie Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME
Publication number
20210091033
Publication date
Mar 25, 2021
Yangtze Memory Technologies Co., Ltd.
Jie Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING CONTACTS HAVING CAPPING LAYER AND METHOD FOR FORMING THE SAME
Publication number
20200051945
Publication date
Feb 13, 2020
Yangtze Memory Technologies Co., Ltd.
Jie Pan
H01 - BASIC ELECTRIC ELEMENTS