JIE QIN

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HUMMELSTOWN, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Substrate having a plural diameter via
- Patent number 8,592,692
- Issue date Nov 26, 2013
- Tyco Electronics Corporation
- Alex Michael Sharf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector having a ground clip
- Patent number 8,221,139
- Issue date Jul 17, 2012
- Tyco Electronics Corporation
- Jie Qin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COAXIAL CONNECTOR
- Publication number 20130157505
- Publication date Jun 20, 2013
- Tyco Electronics Corporation
- Michael Timothy Sykes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING A PLURAL DIAMETER VIA
- Publication number 20130020121
- Publication date Jan 24, 2013
- Tyco Electronics Corporation
- ALEX MICHAEL SHARF
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR HAVING A GROUND CLIP
- Publication number 20120064743
- Publication date Mar 15, 2012
- Tyco Electronic Corporation
- Jie QIN
- H01 - BASIC ELECTRIC ELEMENTS