Jieying KONG

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid glass core for wafer level and panel level packaging applica...
- Patent number 12,191,240
- Issue date Jan 7, 2025
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Minimizing package impedance discontinuity through dielectric struc...
- Patent number 12,125,777
- Issue date Oct 22, 2024
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively roughened copper architectures for low insertion loss c...
- Patent number 12,033,930
- Issue date Jul 9, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass dielectric layer with patterning
- Patent number 11,780,210
- Issue date Oct 10, 2023
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimal signal routing performance through dielectric material conf...
- Patent number 11,574,862
- Issue date Feb 7, 2023
- Intel Corporation
- Zhiguo Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a substrate having interconnects
- Patent number 11,348,865
- Issue date May 31, 2022
- Intel Corporation
- Praneeth Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED PORO...
- Publication number 20250006623
- Publication date Jan 2, 2025
- Intel Corporation
- Shuqi Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES
- Publication number 20240217216
- Publication date Jul 4, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- B32 - LAYERED PRODUCTS
Information Patent Application
ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABIL...
- Publication number 20240222089
- Publication date Jul 4, 2024
- Intel Corporation
- Ala OMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE I...
- Publication number 20240112999
- Publication date Apr 4, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS
- Publication number 20240096561
- Publication date Mar 21, 2024
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD UP MATERIAL ARCHITECTURE FOR MICROELECTRONIC PACKAGE DEVICE
- Publication number 20240006296
- Publication date Jan 4, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006285
- Publication date Jan 4, 2024
- The Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUB...
- Publication number 20230420348
- Publication date Dec 28, 2023
- Intel Corporation
- Jieying KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRON...
- Publication number 20230420353
- Publication date Dec 28, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS DIELECTRIC LAYER WITH PATTERNING
- Publication number 20230405976
- Publication date Dec 21, 2023
- Intel Corporation
- Jieying KONG
- B32 - LAYERED PRODUCTS
Information Patent Application
STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER
- Publication number 20230207503
- Publication date Jun 29, 2023
- Intel Corporation
- Jieying KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC FILM STRESS BUFFER FOR INTERFACE OF METAL AND DIELECTRIC
- Publication number 20230098501
- Publication date Mar 30, 2023
- Intel Corporation
- Sarah BLYTHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE EDGE COUPLING WITHIN A SUBSTRATE
- Publication number 20230090863
- Publication date Mar 23, 2023
- Intel Corporation
- Dilan SENEVIRATNE
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER
- Publication number 20230091834
- Publication date Mar 23, 2023
- Intel Corporation
- Bainye Francoise ANGOUA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING HOLLOW FILLER MATERIALS
- Publication number 20230089928
- Publication date Mar 23, 2023
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI LAYER PACKAGE SUBSTRATE HAVING DIFFERENT DIELECTRIC MATERIALS...
- Publication number 20230090188
- Publication date Mar 23, 2023
- Intel Corporation
- Junxin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRAT...
- Publication number 20230086881
- Publication date Mar 23, 2023
- Intel Corporation
- Whitney BRYKS
- G02 - OPTICS
Information Patent Application
SELECTIVELY ROUGHENED COPPER ARCHITECTURES FOR LOW INSERTION LOSS C...
- Publication number 20220102259
- Publication date Mar 31, 2022
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIMIZING PACKAGE IMPEDANCE DISCONTINUITY THROUGH DIELECTRIC STRUC...
- Publication number 20210125912
- Publication date Apr 29, 2021
- Intel Corporation
- Zhiguo QIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A SUBSTRATE
- Publication number 20210098356
- Publication date Apr 1, 2021
- Praneeth Akkinepally
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS DIELECTRIC LAYER WITH PATTERNING
- Publication number 20210078296
- Publication date Mar 18, 2021
- Intel Corporation
- Jieying KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID GLASS CORE FOR WAFER LEVEL AND PANEL LEVEL PACKAGING APPLICA...
- Publication number 20210050289
- Publication date Feb 18, 2021
- Intel Corporation
- Jieying KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMAL SIGNAL ROUTING PERFORMANCE THROUGH DIELECTRIC MATERIAL CONF...
- Publication number 20200343175
- Publication date Oct 29, 2020
- Intel Corporation
- Zhiguo QIAN
- H01 - BASIC ELECTRIC ELEMENTS

Jieying KONG

Person

Patents Grantslast 30 patents

Hybrid glass core for wafer level and panel level packaging applica...

Minimizing package impedance discontinuity through dielectric struc...

Selectively roughened copper architectures for low insertion loss c...

Glass dielectric layer with patterning

Optimal signal routing performance through dielectric material conf...

Electronic device including a substrate having interconnects

Patents Applicationslast 30 patents

FORMING POROUS DIELECTRIC STRUCTURES WITH SPATIALLY-CONTROLLED PORO...

ULTRATHIN LAMINATED GLASS AND GLASS STIFFENERS FOR CORELESS PACKAGES

ENHANCED DRY DESMEAR EQUIPMENT WITH PROTECTIVE FILM PEELING CAPABIL...

LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE I...

THIN FILM CAPACITORS

BUILD UP MATERIAL ARCHITECTURE FOR MICROELECTRONIC PACKAGE DEVICE

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

SINX ADHESION PROMOTER WITH ADHESION HOLE FEATURES IN PACKAGING SUB...

ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRON...

GLASS DIELECTRIC LAYER WITH PATTERNING

STRESS ARREST LIP ON COPPER PAD FOR LOW ROUGHNESS COPPER

ORGANIC FILM STRESS BUFFER FOR INTERFACE OF METAL AND DIELECTRIC

OPTICAL WAVEGUIDE EDGE COUPLING WITHIN A SUBSTRATE

OPTICAL WAVEGUIDE FORMED WITHIN IN A GLASS LAYER

SEMICONDUCTOR DEVICES HAVING HOLLOW FILLER MATERIALS

MULTI LAYER PACKAGE SUBSTRATE HAVING DIFFERENT DIELECTRIC MATERIALS...

DOUBLE-SIDED GLASS SUBSTRATE WITH A HYBRID BONDED PHOTONIC INTEGRAT...

SELECTIVELY ROUGHENED COPPER ARCHITECTURES FOR LOW INSERTION LOSS C...

MINIMIZING PACKAGE IMPEDANCE DISCONTINUITY THROUGH DIELECTRIC STRUC...

ELECTRONIC DEVICE INCLUDING A SUBSTRATE

GLASS DIELECTRIC LAYER WITH PATTERNING

HYBRID GLASS CORE FOR WAFER LEVEL AND PANEL LEVEL PACKAGING APPLICA...

OPTIMAL SIGNAL ROUTING PERFORMANCE THROUGH DIELECTRIC MATERIAL CONF...