Jih-Churng Twu

Person

Chung-Ho City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of monitoring tool
- Patent number 11,804,392
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hom-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas delivery system for ion implanter
- Patent number 11,569,062
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hom-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tool monitoring device and method of monitoring tool
- Patent number 11,239,099
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hom-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault detection method in semiconductor fabrication facility
- Patent number 11,056,365
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hom-Chung Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method for controlling temperature of furnace in semiconductor fabr...
- Patent number 10,930,527
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Lun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling temperature of furnace in semiconductor fabr...
- Patent number 10,741,426
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Lun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of monitoring high tilt angle of medium current implant
- Patent number 6,924,215
- Issue date Aug 2, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Ta Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a high quality chemical oxide on a freshly clean...
- Patent number 6,878,578
- Issue date Apr 12, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jih-Churng Twu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear chemical mechanical polishing apparatus equipped with progra...
- Patent number 6,837,774
- Issue date Jan 4, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Metrology for monitoring a rapid thermal annealing process
- Patent number 6,777,251
- Issue date Aug 17, 2004
- Taiwan Semiconductor Manufacturing Co. Ltd
- Ching Shan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interface in copper CMP for low K dielectric
- Patent number 6,753,249
- Issue date Jun 22, 2004
- Taiwan Semiconductor Manufacturing Company
- Ying-Ho Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ventilated platen/polishing pad assembly for chemcial mechanical po...
- Patent number 6,722,949
- Issue date Apr 20, 2004
- Taiwan Semiconductors Manufacturing Co., Ltd
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Formation of dual gate oxide by two-step wet oxidation
- Patent number 6,706,577
- Issue date Mar 16, 2004
- Taiwan Semiconductor Manufacturing Company
- Jih-Churng Twu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic charge-free solvent-type dryer for semiconductor wafers
- Patent number 6,647,998
- Issue date Nov 18, 2003
- Taiwan Semiconductor Manufacturing Co. Ltd
- Jih-Churng Twu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for high temperature oxidations to prevent oxide edge peeling
- Patent number 6,642,128
- Issue date Nov 4, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Shan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of Cu line damage by two-step CMP
- Patent number 6,620,725
- Issue date Sep 16, 2003
- Taiwan Semiconductor Manufacturing Company
- Shau-Lin Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of low-high slurry flow to eliminate copper line damages
- Patent number 6,589,872
- Issue date Jul 8, 2003
- Taiwan Semiconductor Manufacturing Company
- Jih-Churng Twu
- B24 - GRINDING POLISHING
Information Patent Grant
Method for cleaning a silicon-based substrate without NH4OH vapor d...
- Patent number 6,589,356
- Issue date Jul 8, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Juin-Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning semiconductor wafers with ozone-containing solvent
- Patent number 6,503,333
- Issue date Jan 7, 2003
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jih-Churng Twu
- B08 - CLEANING
Information Patent Grant
Method to reduce the damages of copper lines
- Patent number 6,500,753
- Issue date Dec 31, 2002
- Taiwan Semiconductor Manufacturing Company
- Syun-Ming Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for wet cleaning wafers without ammonia vapor...
- Patent number 6,500,274
- Issue date Dec 31, 2002
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jih-Churng Twu
- B08 - CLEANING
Information Patent Grant
Use of PE-SiON or PE-Oxide for contact or via photo and for defect...
- Patent number 6,458,689
- Issue date Oct 1, 2002
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elimination of electrochemical deposition copper line damage for da...
- Patent number 6,429,118
- Issue date Aug 6, 2002
- Taiwan Semiconductor Manufacturing Company
- Ying-Ho Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reducing solvent residue in a solvent-type...
- Patent number 6,425,191
- Issue date Jul 30, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd
- Rong-Hui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underlayer liner for copper damascene in low k dielectric
- Patent number 6,417,106
- Issue date Jul 9, 2002
- Taiwan Semiconductor Manufacturing Company
- Jih-Churng Twu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for drying wafers after wet bench
- Patent number 6,405,452
- Issue date Jun 18, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jih-Churng Twu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to prevent copper CMP dishing
- Patent number 6,391,780
- Issue date May 21, 2002
- Taiwan Semiconductor Manufacturing Company
- Tsu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lightly nitridation surface for preparing thin-gate oxides
- Patent number 6,380,056
- Issue date Apr 30, 2002
- Taiwan Semiconductor Manufacturing Company
- Shau-Lin Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post chemical mechanical polish (CMP) planarizing substrate cleanin...
- Patent number 6,376,377
- Issue date Apr 23, 2002
- Taiwan Semiconductor Manufacturing Company
- Weng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to eliminate dishing of copper interconnects by the use of a...
- Patent number 6,372,632
- Issue date Apr 16, 2002
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EDGE FILL FOR STACKED STRUCTURE
- Publication number 20240371818
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME
- Publication number 20240363586
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MONITORING TOOL
- Publication number 20240021453
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hom-Chung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD...
- Publication number 20230369156
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING MET...
- Publication number 20230360993
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MONITORING TOOL
- Publication number 20220130697
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hom-Chung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DELIVERY SYSTEM FOR ION IMPLANTER
- Publication number 20210366690
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hom-Chung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING TEMPERATURE OF FURNACE IN SEMICONDUCTOR FABR...
- Publication number 20200312685
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Lun LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOL MONITORING DEVICE AND METHOD OF MONITORING TOOL
- Publication number 20200105555
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hom-Chung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTROLLING TEMPERATURE OF FURNACE IN SEMICONDUCTOR FABR...
- Publication number 20190096714
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Lun LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAULT DETECTION METHOD IN SEMICONDUCTOR FABRICATION FACILITY
- Publication number 20190096723
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hom-Chung LIN
- G08 - SIGNALLING
Information Patent Application
Partitioned wafer boat for constant wafer backside emmissivity
- Publication number 20040043617
- Publication date Mar 4, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metrology for monitoring a rapid thermal annealing process
- Publication number 20030235928
- Publication date Dec 25, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching Shan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for improving scrubber cleaning
- Publication number 20030230323
- Publication date Dec 18, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming You
- B08 - CLEANING
Information Patent Application
Method of monitoring high tilt angle of medium current implant
- Publication number 20030224541
- Publication date Dec 4, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Ta Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of low-high slurry flow to eliminate copper line damages
- Publication number 20030207582
- Publication date Nov 6, 2003
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Jih-Churng Twu
- B24 - GRINDING POLISHING
Information Patent Application
A METHOD FOR HIGH TEMPERATURE OXIDE LAYER ANNEAL TO PREVENT OXIDE E...
- Publication number 20030207591
- Publication date Nov 6, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Shan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic charge-free solvent-type dryer for semiconductor wafers
- Publication number 20020195130
- Publication date Dec 26, 2002
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Jih-Churng Twu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Linear chemical mechanical polishing apparatus equipped with progra...
- Publication number 20020142704
- Publication date Oct 3, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Application
Ventilated platen/polishing pad assembly for chemical mechanical po...
- Publication number 20020137435
- Publication date Sep 26, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Chen Hu
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus and method for wet cleaning wafers without ammonia vapor...
- Publication number 20020092546
- Publication date Jul 18, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jih-Churng Twu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cleaning semiconductor wafers with ozone-containing solvent
- Publication number 20020062841
- Publication date May 30, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jih-Churng Twu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce the damages of copper lines
- Publication number 20010027010
- Publication date Oct 4, 2001
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Syun-Ming Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of PE-SiON or PE-Oxide for contact or via photo and for defect...
- Publication number 20010016414
- Publication date Aug 23, 2001
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Jih-Churng Twu

Person

Patents Grantslast 30 patents

Method of monitoring tool

Gas delivery system for ion implanter

Tool monitoring device and method of monitoring tool

Fault detection method in semiconductor fabrication facility

Method for controlling temperature of furnace in semiconductor fabr...

Method for controlling temperature of furnace in semiconductor fabr...

Method of monitoring high tilt angle of medium current implant

Method for forming a high quality chemical oxide on a freshly clean...

Linear chemical mechanical polishing apparatus equipped with progra...

Metrology for monitoring a rapid thermal annealing process

Multilayer interface in copper CMP for low K dielectric

Ventilated platen/polishing pad assembly for chemcial mechanical po...

Formation of dual gate oxide by two-step wet oxidation

Electrostatic charge-free solvent-type dryer for semiconductor wafers

Method for high temperature oxidations to prevent oxide edge peeling

Reduction of Cu line damage by two-step CMP

Use of low-high slurry flow to eliminate copper line damages

Method for cleaning a silicon-based substrate without NH4OH vapor d...

Method for cleaning semiconductor wafers with ozone-containing solvent

Method to reduce the damages of copper lines

Apparatus and method for wet cleaning wafers without ammonia vapor...

Use of PE-SiON or PE-Oxide for contact or via photo and for defect...

Elimination of electrochemical deposition copper line damage for da...

Apparatus and method for reducing solvent residue in a solvent-type...

Underlayer liner for copper damascene in low k dielectric

Method and apparatus for drying wafers after wet bench

Method to prevent copper CMP dishing

Lightly nitridation surface for preparing thin-gate oxides

Post chemical mechanical polish (CMP) planarizing substrate cleanin...

Method to eliminate dishing of copper interconnects by the use of a...

Patents Applicationslast 30 patents

EDGE FILL FOR STACKED STRUCTURE

SEMICONDUCTOR PACKAGE AND FORMING METHOD OF THE SAME

METHOD OF MONITORING TOOL

DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD...

DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING MET...

METHOD OF MONITORING TOOL

GAS DELIVERY SYSTEM FOR ION IMPLANTER

METHOD FOR CONTROLLING TEMPERATURE OF FURNACE IN SEMICONDUCTOR FABR...

TOOL MONITORING DEVICE AND METHOD OF MONITORING TOOL

METHOD FOR CONTROLLING TEMPERATURE OF FURNACE IN SEMICONDUCTOR FABR...

FAULT DETECTION METHOD IN SEMICONDUCTOR FABRICATION FACILITY

Partitioned wafer boat for constant wafer backside emmissivity

Metrology for monitoring a rapid thermal annealing process

Apparatus and method for improving scrubber cleaning

Method of monitoring high tilt angle of medium current implant

Use of low-high slurry flow to eliminate copper line damages

A METHOD FOR HIGH TEMPERATURE OXIDE LAYER ANNEAL TO PREVENT OXIDE E...

Electrostatic charge-free solvent-type dryer for semiconductor wafers

Linear chemical mechanical polishing apparatus equipped with progra...

Ventilated platen/polishing pad assembly for chemical mechanical po...

Apparatus and method for wet cleaning wafers without ammonia vapor...

Method for cleaning semiconductor wafers with ozone-containing solvent

Method to reduce the damages of copper lines

Use of PE-SiON or PE-Oxide for contact or via photo and for defect...