Jih-Hwa Lee

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Lungtan Shiang, TW

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Patents Grantslast 30 patents

Information Patent Grant
Coupling device with electro-magnetic compensation
- Patent number 7,508,282
- Issue date Mar 24, 2009
- Chung Shan Institute of Science and Technology
- Jen-I Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Coupling device with electro-magnetic compensation
- Publication number 20080111650
- Publication date May 15, 2008
- Jen-I Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating multi-layer ceramic substrate
- Publication number 20060032574
- Publication date Feb 16, 2006
- Jen-I Kuo
- B32 - LAYERED PRODUCTS
Information Patent Application
[METHOD FOR TUNING PARAMETER OF RF TRANSMISSION LINE AND STRUCTURE...
- Publication number 20040207496
- Publication date Oct 21, 2004
- JIH-HWA LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR