Jiho Kang

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Beaverton, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structures with contoured interconnects
- Patent number 11,710,694
- Issue date Jul 25, 2023
- Intel Corporation
- Ebubekir Dogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchored interconnect
- Patent number 9,818,710
- Issue date Nov 14, 2017
- Intel Corporation
- Jiho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-body via liner deposition
- Patent number 9,748,180
- Issue date Aug 29, 2017
- Intel Corporation
- Puneesh Puri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure comprising fine pitch backside metal redistr...
- Patent number 9,716,066
- Issue date Jul 25, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH CONTOURED INTERCONNECTS
- Publication number 20230317597
- Publication date Oct 5, 2023
- Intel Corporation
- Ebubekir Dogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH CONTOURED INTERCONNECTS
- Publication number 20200373236
- Publication date Nov 26, 2020
- Intel Corporation
- Ebubekir Dogan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHORED INTERCONNECT
- Publication number 20170069589
- Publication date Mar 9, 2017
- Intel Corporation
- JIHO KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-BODY VIA LINER DEPOSITION
- Publication number 20170018509
- Publication date Jan 19, 2017
- Intel Corporation
- PUNEESH PURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE COMPRISING FINE PITCH BACKSIDE METAL REDISTR...
- Publication number 20160049371
- Publication date Feb 18, 2016
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS