Jihua Du

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lens array to disperse zero-order beams of an emitter array on a di...
- Patent number 12,007,576
- Issue date Jun 11, 2024
- Lumentum Operations LLC
- Jihua Du
- G02 - OPTICS
Information Patent Grant
Emitter module
- Patent number 11,467,357
- Issue date Oct 11, 2022
- Lumentum Operations LLC
- Cailin Wei
- G02 - OPTICS
Information Patent Grant
Method and material for attaching a chip to a submount
- Patent number 11,398,446
- Issue date Jul 26, 2022
- Lumentum Operations LLC
- Zhengwei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package and semiconductor device assembly
- Patent number 9,728,935
- Issue date Aug 8, 2017
- Lumentum Operations LLC
- Kong Weng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beam combining light source
- Patent number 8,437,086
- Issue date May 7, 2013
- JDS Uniphase Corporation
- Jihua Du
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Beam combining light source
- Patent number 8,427,749
- Issue date Apr 23, 2013
- JDS Uniphase Corporation
- Jihua Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module with fiber feedthrough
- Patent number 8,215,850
- Issue date Jul 10, 2012
- Prasad Yalamanchili
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM NARROW BANDWIDTH TRANSMISSION FILTER FOR OPTICAL EMITTERS
- Publication number 20240159948
- Publication date May 16, 2024
- Lumentum Operations LLC
- Cailin WEI
- G02 - OPTICS
Information Patent Application
FIBERMOUNT
- Publication number 20240134128
- Publication date Apr 25, 2024
- Lumentum Technology UK Limited
- Zhengwei SHI
- G02 - OPTICS
Information Patent Application
LASER MODULE WITH BEAM ROTATOR
- Publication number 20230178966
- Publication date Jun 8, 2023
- Lumentum Operations LLC
- Cailin WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MATERIAL FOR ATTACHING A CHIP TO A SUBMOUNT
- Publication number 20220359450
- Publication date Nov 10, 2022
- Lumentum Operations LLC
- Zhengwei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTER MODULE
- Publication number 20220196932
- Publication date Jun 23, 2022
- Lumentum Operations LLC
- Cailin WEI
- G02 - OPTICS
Information Patent Application
METHOD AND MATERIAL FOR ATTACHING A CHIP TO A SUBMOUNT
- Publication number 20210082859
- Publication date Mar 18, 2021
- Lumentum Operations LLC
- Zhengwei SHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LENS ARRAY TO DISPERSE ZERO-ORDER BEAMS OF AN EMITTER ARRAY ON A DI...
- Publication number 20200064642
- Publication date Feb 27, 2020
- Lumentum Operations LLC
- Jihua DU
- G02 - OPTICS
Information Patent Application
CHIP-SCALE PACKAGE AND SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20160359295
- Publication date Dec 8, 2016
- Lumentum Operations LLC
- Kong Weng LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEAM COMBINING LIGHT SOURCE
- Publication number 20120002395
- Publication date Jan 5, 2012
- JDS Uniphase Corporation
- Jihua Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEAM COMBINING LIGHT SOURCE
- Publication number 20120002293
- Publication date Jan 5, 2012
- Jihua Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE WITH FIBER FEEDTHROUGH
- Publication number 20110158594
- Publication date Jun 30, 2011
- JDS Uniphase Corporation
- Prasad YALAMANCHILI
- G02 - OPTICS

Person

Patents Grantslast 30 patents

Lens array to disperse zero-order beams of an emitter array on a di...

Emitter module

Method and material for attaching a chip to a submount

Chip-scale package and semiconductor device assembly

Beam combining light source

Beam combining light source

Optical module with fiber feedthrough

Patents Applicationslast 30 patents

THIN FILM NARROW BANDWIDTH TRANSMISSION FILTER FOR OPTICAL EMITTERS

FIBERMOUNT

LASER MODULE WITH BEAM ROTATOR

METHOD AND MATERIAL FOR ATTACHING A CHIP TO A SUBMOUNT

EMITTER MODULE

METHOD AND MATERIAL FOR ATTACHING A CHIP TO A SUBMOUNT

LENS ARRAY TO DISPERSE ZERO-ORDER BEAMS OF AN EMITTER ARRAY ON A DI...

CHIP-SCALE PACKAGE AND SEMICONDUCTOR DEVICE ASSEMBLY

BEAM COMBINING LIGHT SOURCE

BEAM COMBINING LIGHT SOURCE

OPTICAL MODULE WITH FIBER FEEDTHROUGH