Jihun JUNG

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Suwon-si, KR

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE IN A STACK FORM
- Publication number 20240387420
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Soyeon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING A...
- Publication number 20240312823
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240178191
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Jihun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP SPLITTING METHOD USING A LASER AND SEMICONDUCTOR...
- Publication number 20240157481
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR