JiHwan SUH

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and a method for manufacturing the same
- Patent number 12,040,313
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,955,449
- Issue date Apr 9, 2024
- Samsung Electronics Co, Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,791,308
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Jihwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill material layer and method...
- Patent number 11,764,192
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Jihwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 11,721,673
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing the same
- Patent number 11,658,148
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,508,685
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill material layer and method...
- Patent number 11,404,395
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Jihwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,362,062
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Jihwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked semiconductor chips
- Patent number 11,244,927
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240421016
- Publication date Dec 19, 2024
- Samsung Electronics Co.,Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332255
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20230253363
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20230076511
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- JIHWAN SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...
- Publication number 20220344308
- Publication date Oct 27, 2022
- Samsung Electronics Co., Ltd.
- Jihwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220285312
- Publication date Sep 8, 2022
- Samsung Electronics Co., Ltd.
- Jihwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220130801
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Hyuekjae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210375823
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Jihwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...
- Publication number 20210151410
- Publication date May 20, 2021
- Samsung Electronics Co., Ltd.
- Jihwan HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20210125955
- Publication date Apr 29, 2021
- Samsung Electronics Co., Ltd.
- JIHWAN SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20210028146
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS
- Publication number 20210028152
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- Hyuekjae LEE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and a method for manufacturing the same

Stacked semiconductor package

Semiconductor package

Semiconductor package including underfill material layer and method...

Semiconductor package having stacked semiconductor chips

Semiconductor package and a method for manufacturing the same

Stacked semiconductor package

Semiconductor package including underfill material layer and method...

Semiconductor package

Semiconductor package having stacked semiconductor chips

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL MATERIAL LAYER AND METHOD...

STACKED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING STACKED SEMICONDUCTOR CHIPS