Jihwang Kim

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure having interposer substrate, and st...
- Patent number 12,148,729
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer and method of manufactur...
- Patent number 12,021,036
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including molding layer
- Patent number 11,817,401
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 11,804,477
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor packages
- Patent number 11,798,889
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 11,710,673
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having supporting members
- Patent number 11,676,949
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Taeseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, and package on package having the same
- Patent number 11,581,263
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer and method of manufactur...
- Patent number 11,521,934
- Issue date Dec 6, 2022
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an embedded semiconductor device
- Patent number 11,404,382
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Jihwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with interposer
- Patent number 11,367,688
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321839
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240312974
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- KYOUNGLIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20240186231
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jihwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120280
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113001
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Kyounglim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240040806
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER
- Publication number 20240030161
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Dongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20240014191
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230112061
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Eunho CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20230075292
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230063578
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Eunho CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230042622
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A LOWER SUBSTRATE AND AN UPPER SUBS...
- Publication number 20230021867
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING INTERPOSER SUBSTRATE, AND ST...
- Publication number 20220352110
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER
- Publication number 20220344279
- Publication date Oct 27, 2022
- Samsung Electronics Co., Ltd.
- Dongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTERPOSER
- Publication number 20220302035
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220189835
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20220181309
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SUPPORTING MEMBERS
- Publication number 20220173081
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Taeseok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20220013464
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND PACKAGE ON PACKAGE HAVING THE SAME
- Publication number 20210257305
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210183777
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20210050297
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Jihwang Kim
- H01 - BASIC ELECTRIC ELEMENTS

Jihwang Kim

Person

Patents Grantslast 30 patents

Semiconductor package structure having interposer substrate, and st...

Semiconductor package including interposer and method of manufactur...

Semiconductor package including molding layer

Semiconductor device having package on package structure and method...

Methods of manufacturing semiconductor packages

Interposer and semiconductor package including the same

Semiconductor packages having supporting members

Semiconductor package, and package on package having the same

Semiconductor package including interposer and method of manufactur...

Semiconductor package including an embedded semiconductor device

Semiconductor package with interposer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A LOWER SUBSTRATE AND AN UPPER SUBS...

SEMICONDUCTOR PACKAGE STRUCTURE HAVING INTERPOSER SUBSTRATE, AND ST...

SEMICONDUCTOR PACKAGE INCLUDING MOLDING LAYER

SEMICONDUCTOR PACKAGE WITH INTERPOSER

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGES HAVING SUPPORTING MEMBERS

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE, AND PACKAGE ON PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING AN EMBEDDED SEMICONDUCTOR DEVICE