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Singapore, SG
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last 30 patents
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Patent Grant
Enhancing metal/low-K interconnect reliability using a protection l...
Patent number
8,486,824
Issue date
Jul 16, 2013
STMicroelectronics Asia Pacific Pte., Ltd.
Tong Yan Tee
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Enhancing metal/low-K interconnect reliability using a protection l...
Patent number
8,217,518
Issue date
Jul 10, 2012
STMicroelectronics Asia Pacific Pte., Ltd.
Tong Yan Tee
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for patterning large scale nano-fibrous surfaces using capil...
Patent number
7,491,628
Issue date
Feb 17, 2009
California Institute of Technology
Flavio Noca
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
ENHANCING METAL/LOW-K INTERCONNECT RELIABILITY USING A PROTECTION L...
Publication number
20130012016
Publication date
Jan 10, 2013
STMicroelectronics Asia Pacific Pte. Ltd.
Tong Yan Tee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Enhancing metal/low-K interconnect reliability using a protection l...
Publication number
20070216032
Publication date
Sep 20, 2007
STMicroelectronics Asia Pacific Pte. Ltd.
Tong Yan Tee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for patterning large scale nano-fibrous surfaces using capil...
Publication number
20060088848
Publication date
Apr 27, 2006
Flavio Noca
B82 - NANO-TECHNOLOGY