Jim BALDINO

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Portland, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication of through-silicon vias on silicon wafers
- Patent number 8,329,575
- Issue date Dec 11, 2012
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of through-silicon vias on silicon wafers
- Patent number 8,283,237
- Issue date Oct 9, 2012
- Applied Materials, Inc.
- Nagarajan Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
- Publication number 20120164827
- Publication date Jun 28, 2012
- Applied Materials, Inc.
- Nagarajan RAJAGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
- Publication number 20120164829
- Publication date Jun 28, 2012
- Applied Materials, Inc.
- Nagarajan RAJAGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS