Jim Clatterbaugh

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Santa Rosa, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Through-chip via interconnects for stacked integrated circuit struc...
- Patent number 7,911,066
- Issue date Mar 22, 2011
- Agilent Technologies, Inc.
- Eric R Ehlers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection for high-frequency devices
- Patent number 7,408,119
- Issue date Aug 5, 2008
- Agilent Technologies, Inc.
- Xiaohui Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection for coaxial line to slab line structure...
- Patent number 7,295,084
- Issue date Nov 13, 2007
- Agilent Technologies, Inc.
- Hassan Tanbakuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Center Conductor to Integrated Circuit for High Frequency Applications
- Publication number 20090079042
- Publication date Mar 26, 2009
- AGILENT TECHNOLOGIES, INC.
- Jim Clatterbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Chip Via Interconnects for Stacked Integrated Circuit Struc...
- Publication number 20090057872
- Publication date Mar 5, 2009
- Eric R. Ehlers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High isolation, low loss electronic interconnection
- Publication number 20070069832
- Publication date Mar 29, 2007
- Hassan Tanbakuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical interconnection for high-frequency devices
- Publication number 20050083153
- Publication date Apr 21, 2005
- Xiaohui Qin
- H01 - BASIC ELECTRIC ELEMENTS