Jim Shih-Chun Liang

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
MIM capacitor structures
- Patent number 11,688,680
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance metal insulator metal capacitor
- Patent number 11,437,312
- Issue date Sep 6, 2022
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
E-fuse co-processed with MIM capacitor
- Patent number 11,257,750
- Issue date Feb 22, 2022
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On integrated circuit (IC) device simultaneously formed capacitor a...
- Patent number 11,244,850
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device integral capacitor and anti-fuse
- Patent number 11,145,591
- Issue date Oct 12, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EFuse structure with multiple links
- Patent number 11,101,213
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back end of line (BEOL) time dependent dielectric breakdown (TDDB)...
- Patent number 10,998,263
- Issue date May 4, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and interconnect structures
- Patent number 10,741,497
- Issue date Aug 11, 2020
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form interconnect structure with tungsten fill
- Patent number 10,490,501
- Issue date Nov 26, 2019
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce resistance for a copper (Cu) interconnect landing...
- Patent number 10,403,574
- Issue date Sep 3, 2019
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact element structure of a semiconductor device
- Patent number 10,354,918
- Issue date Jul 16, 2019
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 10,347,529
- Issue date Jul 9, 2019
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact element of a semiconductor device and c...
- Patent number 10,249,534
- Issue date Apr 2, 2019
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce resistance for a copper (CU) interconnect landing...
- Patent number 9,991,202
- Issue date Jun 5, 2018
- GLOBALFOUNDRIES Inc.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of IC structure with metal plug
- Patent number 9,793,216
- Issue date Oct 17, 2017
- GLOBALFOUNDRIES Inc.
- Joyeeta Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless metallization contacts
- Patent number 9,633,946
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with metal crack stop and methods of f...
- Patent number 9,589,911
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with crack stop and method of forming...
- Patent number 9,589,912
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardmask removal for copper interconnects with tungsten contacts by...
- Patent number 9,293,365
- Issue date Mar 22, 2016
- GLOBALFOUNDRIES Inc.
- Domingo A. Ferrer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MIM CAPACITOR STRUCTURES
- Publication number 20220139820
- Publication date May 5, 2022
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON INTEGRATED CIRCUIT (IC) DEVICE CAPACITOR BETWEEN METAL LINES
- Publication number 20210287984
- Publication date Sep 16, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
E-FUSE CO-PROCESSED WITH MIM CAPACITOR
- Publication number 20210249348
- Publication date Aug 12, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE METAL INSULATOR METAL CAPACITOR
- Publication number 20210249349
- Publication date Aug 12, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFUSE STRUCTURE WITH MULTIPLE LINKS
- Publication number 20210233844
- Publication date Jul 29, 2021
- International Business Machines Corporation
- BAOZHEN LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON INTEGRATED CIRCUIT (IC) DEVICE SIMULTANEOUSLY FORMED CAPACITOR A...
- Publication number 20210151345
- Publication date May 20, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE INTEGRAL CAPACITOR AND ANTI-FUSE
- Publication number 20210151373
- Publication date May 20, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE (BEOL) TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB)...
- Publication number 20200395294
- Publication date Dec 17, 2020
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND INTERCONNECT STRUCTURES
- Publication number 20190252320
- Publication date Aug 15, 2019
- GLOBALFOUNDRIES INC.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT ELEMENT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20190181044
- Publication date Jun 13, 2019
- GLOBALFOUNDRIES INC.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20190103310
- Publication date Apr 4, 2019
- GLOBALFOUNDRIES INC.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CONTACT ELEMENT OF A SEMICONDUCTOR DEVICE AND C...
- Publication number 20180350679
- Publication date Dec 6, 2018
- GLOBALFOUNDRIES INC.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180166385
- Publication date Jun 14, 2018
- GLOBALFOUNDRIES INC.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180138123
- Publication date May 17, 2018
- GLOBALFOUNDRIES INC.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING...
- Publication number 20180096933
- Publication date Apr 5, 2018
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF IC STRUCTURE WITH METAL PLUG
- Publication number 20170213792
- Publication date Jul 27, 2017
- GLOBALFOUNDRIES INC.
- Joyeeta Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH CRACK STOP AND METHOD OF FORMING...
- Publication number 20170062355
- Publication date Mar 2, 2017
- GLOBALFOUNDRIES INC.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH METAL CRACK STOP AND METHODS OF F...
- Publication number 20170062354
- Publication date Mar 2, 2017
- GLOBALFOUNDRIES INC.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING...
- Publication number 20170005037
- Publication date Jan 5, 2017
- International Business Machines Corporation
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARDMASK REMOVAL FOR COPPER INTERCONNECTS WITH TUNGSTEN CONTACTS BY...
- Publication number 20150279733
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Domingo A. Ferrer
- H01 - BASIC ELECTRIC ELEMENTS

Jim Shih-Chun Liang

Person

Patents Grantslast 30 patents

MIM capacitor structures

High performance metal insulator metal capacitor

E-fuse co-processed with MIM capacitor

On integrated circuit (IC) device simultaneously formed capacitor a...

Integrated circuit (IC) device integral capacitor and anti-fuse

EFuse structure with multiple links

Back end of line (BEOL) time dependent dielectric breakdown (TDDB)...

Contact and interconnect structures

Method to form interconnect structure with tungsten fill

Method to reduce resistance for a copper (Cu) interconnect landing...

Contact element structure of a semiconductor device

Interconnect structures

Method of forming a contact element of a semiconductor device and c...

Method to reduce resistance for a copper (CU) interconnect landing...

Fabrication of IC structure with metal plug

Seamless metallization contacts

Integrated circuit structure with metal crack stop and methods of f...

Integrated circuit structure with crack stop and method of forming...

Hardmask removal for copper interconnects with tungsten contacts by...

Patents Applicationslast 30 patents

MIM CAPACITOR STRUCTURES

ON INTEGRATED CIRCUIT (IC) DEVICE CAPACITOR BETWEEN METAL LINES

E-FUSE CO-PROCESSED WITH MIM CAPACITOR

HIGH PERFORMANCE METAL INSULATOR METAL CAPACITOR

EFUSE STRUCTURE WITH MULTIPLE LINKS

ON INTEGRATED CIRCUIT (IC) DEVICE SIMULTANEOUSLY FORMED CAPACITOR A...

INTEGRATED CIRCUIT (IC) DEVICE INTEGRAL CAPACITOR AND ANTI-FUSE

BACK END OF LINE (BEOL) TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB)...

CONTACT AND INTERCONNECT STRUCTURES

CONTACT ELEMENT STRUCTURE OF A SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURES

METHOD OF FORMING A CONTACT ELEMENT OF A SEMICONDUCTOR DEVICE AND C...

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING...

FABRICATION OF IC STRUCTURE WITH METAL PLUG

INTEGRATED CIRCUIT STRUCTURE WITH CRACK STOP AND METHOD OF FORMING...

INTEGRATED CIRCUIT STRUCTURE WITH METAL CRACK STOP AND METHODS OF F...

METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING...

HARDMASK REMOVAL FOR COPPER INTERCONNECTS WITH TUNGSTEN CONTACTS BY...