Jim Williams

Person

Forest Grove, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Immersion cooling for integrated circuit devices
- Patent number 12,238,892
- Issue date Feb 25, 2025
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for removing heat
- Patent number 7,340,904
- Issue date Mar 11, 2008
- Intel Corporation
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Interchangeable and modular I/O panel
- Patent number 6,550,877
- Issue date Apr 22, 2003
- Intel Corporation
- Paul H. Anderson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hot swap drawer assembly
- Patent number 6,535,381
- Issue date Mar 18, 2003
- Intel Corporation
- Craig J. Jahne
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hot swap disk drive carrier and disk drive bay
- Patent number 6,421,236
- Issue date Jul 16, 2002
- Intel Corporation
- Tommy S. Montoya
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual processor assembly retention member
- Patent number 6,166,920
- Issue date Dec 26, 2000
- Intel Corporation
- Michael R. Schweers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrochromic edge isolation-interconnect system, process, and dev...
- Patent number 5,657,150
- Issue date Aug 12, 1997
- Eyeonics Corporation
- William R. Kallman
- G02 - OPTICS
Information Patent Grant
Modular peripheral platform having two disk drives and one electric...
- Patent number 5,214,567
- Issue date May 25, 1993
- Intel Corporation
- Rick Feightner
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
TWO PHASE IMMERSION COOLING SYSTEM WITH USEABLE WARMED LIQUID OUTPUT
- Publication number 20220256744
- Publication date Aug 11, 2022
- Intel Corporation
- Linh M. LE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SYSTEM LIQUID COOLING APPARATUS WITH SUSTAINED HEAT OUTP...
- Publication number 20220217876
- Publication date Jul 7, 2022
- Intel Corporation
- Paul J. GWIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20220201889
- Publication date Jun 23, 2022
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for removing heat
- Publication number 20060090474
- Publication date May 4, 2006
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Hot swap drawer assembly
- Publication number 20020135976
- Publication date Sep 26, 2002
- Craig J. Jahne
- G06 - COMPUTING CALCULATING COUNTING

Jim Williams

Person

Patents Grantslast 30 patents

Immersion cooling for integrated circuit devices

Method and apparatus for removing heat

Interchangeable and modular I/O panel

Hot swap drawer assembly

Hot swap disk drive carrier and disk drive bay

Dual processor assembly retention member

Electrochromic edge isolation-interconnect system, process, and dev...

Modular peripheral platform having two disk drives and one electric...

Patents Applicationslast 30 patents

TWO PHASE IMMERSION COOLING SYSTEM WITH USEABLE WARMED LIQUID OUTPUT

ELECTRONIC SYSTEM LIQUID COOLING APPARATUS WITH SUSTAINED HEAT OUTP...

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

Method and apparatus for removing heat

Hot swap drawer assembly