Jimin CHOI

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal pad, semiconductor chip including the same and method of ma...
- Patent number 12,159,859
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection pad structure for analysis in a semiconductor device
- Patent number 12,072,374
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for storage of carrying material
- Patent number 12,006,144
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Gyeongdam Baek
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,948,882
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system including shelf moving module
- Patent number 11,881,422
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Hujong Lee
- B66 - HOISTING LIFTING HAULING
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 11,646,225
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Myeong-Dong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,897
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,495,533
- Issue date Nov 8, 2022
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,476,220
- Issue date Oct 18, 2022
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 10,796,950
- Issue date Oct 6, 2020
- Samsung Electronics Co., Ltd.
- Myeong-Dong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of fabricating the same
- Patent number 10,211,091
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Myeong-Dong Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...
- Publication number 20240332228
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Joongwon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTONOMOUS DRIVING ROBOT AND ARTICLE TRANSPORT METHOD USING THE SAME
- Publication number 20240189991
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Gyeongdam Baek
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240194624
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153919
- Publication date May 9, 2024
- Samsung Electronics Co., LTD
- Hyeonjeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
- Publication number 20240145317
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Joongwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113077
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Nara LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071923
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Minjun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240069093
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Sehyun Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
- Publication number 20240038675
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230138616
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...
- Publication number 20230116911
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MULTI-CAPPING LAYER AND METHOD FOR M...
- Publication number 20230080862
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20230077803
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...
- Publication number 20230078980
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH STEPPED SIDEWALL, SEMICONDUCTOR PACKAGE INC...
- Publication number 20230076238
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Junhyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE SYSTEM INCLUDING SHELF MOVING MODULE
- Publication number 20230052015
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Hujong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230043650
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230030117
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Juik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE
- Publication number 20220326301
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEERING DEVICES FOR OHT
- Publication number 20220285189
- Publication date Sep 8, 2022
- Samsung Electronics Co., Ltd.
- Sangjune BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STORAGE OF CARRYING MATERIAL
- Publication number 20220144542
- Publication date May 12, 2022
- Samsung Electronics Co., Ltd.
- Gyeongdam BAEK
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
INSPECTION APPARATUS OF WAFER
- Publication number 20210366102
- Publication date Nov 25, 2021
- Samsung Electronics Co., Ltd.
- Suhwan PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210305188
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- JOONGWON SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210305190
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210305153
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- Jihoon CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20210020495
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- Myeong-Dong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20190157133
- Publication date May 23, 2019
- Samsung Electronics Co., Ltd.
- Myeong-Dong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20170125283
- Publication date May 4, 2017
- Samsung Electronics Co., Ltd.
- Myeong-Dong LEE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal pad, semiconductor chip including the same and method of ma...

Detection pad structure for analysis in a semiconductor device

Apparatus for storage of carrying material

Semiconductor device and method of fabricating the same

Storage system including shelf moving module

Semiconductor devices and methods of fabricating the same

Semiconductor device

Semiconductor device and method of fabricating the same

Semiconductor packages

Semiconductor devices and methods of fabricating the same

Semiconductor devices and methods of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

AUTONOMOUS DRIVING ROBOT AND ARTICLE TRANSPORT METHOD USING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING TEST PADS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...

SEMICONDUCTOR DEVICE INCLUDING MULTI-CAPPING LAYER AND METHOD FOR M...

SEMICONDUCTOR DEVICES

THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...

SEMICONDUCTOR CHIP WITH STEPPED SIDEWALL, SEMICONDUCTOR PACKAGE INC...

STORAGE SYSTEM INCLUDING SHELF MOVING MODULE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

DETECTION PAD STRUCTURE FOR ANALYSIS IN A SEMICONDUCTOR DEVICE

STEERING DEVICES FOR OHT

APPARATUS FOR STORAGE OF CARRYING MATERIAL

INSPECTION APPARATUS OF WAFER

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME