Jimin Yao

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 12,224,261
- Issue date Feb 11, 2025
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 12,205,915
- Issue date Jan 21, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package 3D antenna
- Patent number 12,003,023
- Issue date Jun 4, 2024
- Intel Corporation
- Zhenguo Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-use package architecture
- Patent number 11,929,295
- Issue date Mar 12, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package using ball attach array to connect antenna and base...
- Patent number 11,870,163
- Issue date Jan 9, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 11,735,552
- Issue date Aug 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligned core balls for interconnect joint stability
- Patent number 11,735,551
- Issue date Aug 22, 2023
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading layer integrated within a composite IC die structure...
- Patent number 11,581,238
- Issue date Feb 14, 2023
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package (PoP) with solder array thermal contacts
- Patent number 11,387,175
- Issue date Jul 12, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package using ball attach array to connect antenna and base...
- Patent number 11,355,849
- Issue date Jun 7, 2022
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust mold integrated substrate
- Patent number 11,322,455
- Issue date May 3, 2022
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed hybrid bonding structures and methods of forming the same
- Patent number 11,183,477
- Issue date Nov 23, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading layer integrated within a composite IC die structure...
- Patent number 11,049,791
- Issue date Jun 29, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package with recessed substrate for underfill con...
- Patent number 10,672,625
- Issue date Jun 2, 2020
- Intel Corporation
- Sergio A. Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable ball height on ball grid array packages by solder paste tr...
- Patent number 10,504,863
- Issue date Dec 10, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using plasma gas
- Patent number 10,297,567
- Issue date May 21, 2019
- Intel Corporation
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable ball height on ball grid array packages by solder paste tr...
- Patent number 10,256,205
- Issue date Apr 9, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 10,249,515
- Issue date Apr 2, 2019
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable ball height on ball grid array packages by solder paste tr...
- Patent number 9,842,818
- Issue date Dec 12, 2017
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structures
- Patent number 9,721,880
- Issue date Aug 1, 2017
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20240063544
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063178
- Publication date Feb 22, 2024
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20230343738
- Publication date Oct 26, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FRO...
- Publication number 20230084375
- Publication date Mar 16, 2023
- Intel Corporation
- Priyanka Dobriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20220216611
- Publication date Jul 7, 2022
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-USE PACKAGE ARCHITECTURE
- Publication number 20220181227
- Publication date Jun 9, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST MOLD INTEGRATED SUBSTRATE
- Publication number 20220165686
- Publication date May 26, 2022
- Intel Corporation
- Jimin Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20220020716
- Publication date Jan 20, 2022
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER INTEGRATED WITHIN A COMPOSITE IC DIE STRUCTURE...
- Publication number 20210280492
- Publication date Sep 9, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADING LAYER INTEGRATED WITHIN A COMPOSITE IC DIE STRUCTURE...
- Publication number 20210202347
- Publication date Jul 1, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20210098411
- Publication date Apr 1, 2021
- Intel Corporation
- Shawna Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20200411464
- Publication date Dec 31, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER FOR ETCHED IDENTIFICATION MARKS ON A PACKAGE
- Publication number 20200388576
- Publication date Dec 10, 2020
- Intel Corporation
- Taylor GAINES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALIGNED CORE BALLS FOR INTERCONNECT JOINT STABILITY
- Publication number 20200312803
- Publication date Oct 1, 2020
- Intel Corporation
- Jimin YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20200303822
- Publication date Sep 24, 2020
- Intel Corporation
- Jimin YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PACKAGE 3D ANTENNA
- Publication number 20200243956
- Publication date Jul 30, 2020
- Intel Corporation
- ZHENGUO JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER PACKAGE-ON-PACKAGE (POP) WITH SOLDER ARRAY THERMAL CONTACTS
- Publication number 20200051899
- Publication date Feb 13, 2020
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-USE PACKAGE ARCHITECTURE
- Publication number 20190287872
- Publication date Sep 19, 2019
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20190228988
- Publication date Jul 25, 2019
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST MOLD INTEGRATED SUBSTRATE
- Publication number 20190189567
- Publication date Jun 20, 2019
- Intel Corporation
- Jimin Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...
- Publication number 20190096838
- Publication date Mar 28, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20190074199
- Publication date Mar 7, 2019
- Intel Corporation
- Sergio A. Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...
- Publication number 20180068969
- Publication date Mar 8, 2018
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20170287735
- Publication date Oct 5, 2017
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH COMPONENT PLACEMENT TEMPLATE
- Publication number 20170290211
- Publication date Oct 5, 2017
- Intel Corporation
- DANIEL CHAVEZ-CLEMENTE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...
- Publication number 20170278816
- Publication date Sep 28, 2017
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING USING PLASMA GAS
- Publication number 20170179070
- Publication date Jun 22, 2017
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PICK AND PLACE HEAD FOR HANDLING COMPONENTS OF ANY SHAPE
- Publication number 20170166407
- Publication date Jun 15, 2017
- Intel Corporation
- Kumar Abhishek Singh
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURES
- Publication number 20170170105
- Publication date Jun 15, 2017
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Mixed hybrid bonding structures and methods of forming the same

Microelectronic package with solder array thermal interface materia...

In-package 3D antenna

Multi-use package architecture

Antenna package using ball attach array to connect antenna and base...

Microelectronic package with solder array thermal interface materia...

Aligned core balls for interconnect joint stability

Heat spreading layer integrated within a composite IC die structure...

Interposer package-on-package (PoP) with solder array thermal contacts

Antenna package using ball attach array to connect antenna and base...

Robust mold integrated substrate

Mixed hybrid bonding structures and methods of forming the same

Heat spreading layer integrated within a composite IC die structure...

Electronic device package with recessed substrate for underfill con...

Variable ball height on ball grid array packages by solder paste tr...

Thermocompression bonding using plasma gas

Variable ball height on ball grid array packages by solder paste tr...

Electronic device package

Variable ball height on ball grid array packages by solder paste tr...

Integrated circuit package structures

Patents Applicationslast 30 patents

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

QUASI-MONOLITHIC DIE ARCHITECTURES

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

SELECTIVE PROTECTION OF INTEGRATED CIRCUIT CHIP SURFACE REGIONS FRO...

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

MULTI-USE PACKAGE ARCHITECTURE

ROBUST MOLD INTEGRATED SUBSTRATE

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

HEAT SPREADING LAYER INTEGRATED WITHIN A COMPOSITE IC DIE STRUCTURE...

HEAT SPREADING LAYER INTEGRATED WITHIN A COMPOSITE IC DIE STRUCTURE...

MIXED HYBRID BONDING STRUCTURES AND METHODS OF FORMING THE SAME

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

LAYER FOR ETCHED IDENTIFICATION MARKS ON A PACKAGE

ALIGNED CORE BALLS FOR INTERCONNECT JOINT STABILITY

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

IN-PACKAGE 3D ANTENNA

INTERPOSER PACKAGE-ON-PACKAGE (POP) WITH SOLDER ARRAY THERMAL CONTACTS

MULTI-USE PACKAGE ARCHITECTURE

ELECTRONIC DEVICE PACKAGE

ROBUST MOLD INTEGRATED SUBSTRATE

VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...

ELECTRONIC DEVICE PACKAGE

VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...

ELECTRONIC DEVICE PACKAGE

BATCH COMPONENT PLACEMENT TEMPLATE

VARIABLE BALL HEIGHT ON BALL GRID ARRAY PACKAGES BY SOLDER PASTE TR...

THERMOCOMPRESSION BONDING USING PLASMA GAS

UNIVERSAL PICK AND PLACE HEAD FOR HANDLING COMPONENTS OF ANY SHAPE

INTEGRATED CIRCUIT PACKAGE STRUCTURES