Jimin Zhang

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer edge asymmetry correction using groove in polishing pad
- Patent number 12,285,838
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer edge asymmetry correction using groove in polishing pad
- Patent number 11,951,589
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing using time share control
- Patent number 11,931,854
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing using time share control
- Patent number 11,883,923
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method of substrate edge cleaning and substrate carri...
- Patent number 11,823,916
- Issue date Nov 21, 2023
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensation for substrate doping for in-situ electromagnetic induc...
- Patent number 11,780,045
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetry correction via variable relative velocity of a wafer
- Patent number 11,764,069
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing using time share control
- Patent number 11,298,794
- Issue date Apr 12, 2022
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Chattering correction for accurate sensor position determination on...
- Patent number 10,898,986
- Issue date Jan 26, 2021
- Applied Materials, Inc.
- Harry Q. Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint control of multiple substrate zones of varying thickness i...
- Patent number 10,589,397
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Alain Duboust
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Modifying substrate thickness profiles
- Patent number 10,464,184
- Issue date Nov 5, 2019
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Overpolishing based on electromagnetic inductive monitoring of tren...
- Patent number 10,350,723
- Issue date Jul 16, 2019
- Applied Materials, Inc.
- Shih-Haur Shen
- B24 - GRINDING POLISHING
Information Patent Grant
Orbital polishing with small pad
- Patent number 10,076,817
- Issue date Sep 18, 2018
- Applied Materials, Inc.
- Hung Chih Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing control using weighting with default sequence
- Patent number 9,296,084
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint detection during polishing using integrated differential i...
- Patent number 9,248,544
- Issue date Feb 2, 2016
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Thin polishing pad with window and molding process
- Patent number 9,138,858
- Issue date Sep 22, 2015
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control of chemical mechanical polishing
- Patent number 9,005,999
- Issue date Apr 14, 2015
- Applied Materials, Inc.
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection of layer clearing using spectral monitoring
- Patent number 8,860,932
- Issue date Oct 14, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic selection of reference spectra library
- Patent number 8,755,928
- Issue date Jun 17, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint control of multiple substrates of varying thickness on the...
- Patent number 8,694,144
- Issue date Apr 8, 2014
- Applied Materials, Inc.
- Alain Duboust
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic initiation of reference spectra library generation for op...
- Patent number 8,666,665
- Issue date Mar 4, 2014
- Applied Materials, Inc.
- Jeffrey Drue David
- B24 - GRINDING POLISHING
Information Patent Grant
Control of overpolishing of multiple substrates on the same platen...
- Patent number 8,616,935
- Issue date Dec 31, 2013
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Thin polishing pad with window and molding process
- Patent number 8,562,389
- Issue date Oct 22, 2013
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with partially recessed window
- Patent number 8,475,228
- Issue date Jul 2, 2013
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making and apparatus having windowless polishing pad and...
- Patent number 8,465,342
- Issue date Jun 18, 2013
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint control of multiple-wafer chemical mechanical polishing
- Patent number 8,295,967
- Issue date Oct 23, 2012
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Use of pad conditioning in temperature controlled CMP
- Patent number 8,292,691
- Issue date Oct 23, 2012
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making and apparatus having windowless polishing pad and...
- Patent number 8,157,614
- Issue date Apr 17, 2012
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with window having multiple portions
- Patent number 7,942,724
- Issue date May 17, 2011
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING
Information Patent Grant
Pad conditioner
- Patent number 7,815,495
- Issue date Oct 19, 2010
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HOT SPOT CORRECTION FOR A CHEMICAL MECHANICAL POLISHING P...
- Publication number 20250153303
- Publication date May 15, 2025
- Applied Materials, Inc.
- Priscilla LAROSA
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING-RING-LESS CMP PROCESS
- Publication number 20250114903
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chen-Wei Chang
- B24 - GRINDING POLISHING
Information Patent Application
PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING
- Publication number 20240371646
- Publication date Nov 7, 2024
- Applied Materials, Inc.
- Jimin ZHANG
- B24 - GRINDING POLISHING
Information Patent Application
DETERMINING THE ORIENTATION OF A SUBSTRATE IN-SITU
- Publication number 20240359291
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Wei LU
- B24 - GRINDING POLISHING
Information Patent Application
INDEX POLISHING FOR PROCESS CONTROL SIGNAL AND WAFER UNIFORMITY
- Publication number 20240269796
- Publication date Aug 15, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY
- Publication number 20240253183
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Priscilla Michelle Diep LAROSA
- B24 - GRINDING POLISHING
Information Patent Application
WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD
- Publication number 20240075583
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD OF SUBSTRATE EDGE CLEANING AND SUBSTRATE CARRI...
- Publication number 20240047238
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Wei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRY CORRECTION VIA VARIABLE RELATIVE VELOCITY OF A WAFER
- Publication number 20220379428
- Publication date Dec 1, 2022
- Applied Materials, Inc.
- Jimin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING USING TIME SHARE CONTROL
- Publication number 20220234163
- Publication date Jul 28, 2022
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD OF SUBSTRATE EDGE CLEANING AND SUBSTRATE CARRI...
- Publication number 20220148892
- Publication date May 12, 2022
- Applied Materials, Inc.
- Wei LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD
- Publication number 20210154796
- Publication date May 27, 2021
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING USING TIME SHARE CONTROL
- Publication number 20200282509
- Publication date Sep 10, 2020
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
COMPENSATION FOR SUBSTRATE DOPING FOR IN-SITU ELECTROMAGNETIC INDUC...
- Publication number 20190389028
- Publication date Dec 26, 2019
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Application
Chattering Correction for Accurate Sensor Position Determination on...
- Publication number 20190084119
- Publication date Mar 21, 2019
- Harry Q. Lee
- B24 - GRINDING POLISHING
Information Patent Application
OVERPOLISHING BASED ON ELECTROMAGNETIC INDUCTIVE MONITORING OF TREN...
- Publication number 20180079048
- Publication date Mar 22, 2018
- Applied Materials, Inc.
- Shih-Haur Shen
- B24 - GRINDING POLISHING
Information Patent Application
MONITORING OF POLISHING PAD THICKNESS FOR CHEMICAL MECHANICAL POLIS...
- Publication number 20180056476
- Publication date Mar 1, 2018
- Applied Materials, Inc.
- Jimin Zhang
- G01 - MEASURING TESTING
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...
- Publication number 20170151647
- Publication date Jun 1, 2017
- Applied Materials, Inc.
- Alain Duboust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORBITAL POLISHING WITH SMALL PAD
- Publication number 20160016280
- Publication date Jan 21, 2016
- Applied Materials, Inc.
- Hung Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modifying Substrate Thickness Profiles
- Publication number 20150321312
- Publication date Nov 12, 2015
- Applied Materials, Inc.
- Jimin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...
- Publication number 20140222188
- Publication date Aug 7, 2014
- Applied Materials, Inc.
- Alain Duboust
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Automatic Initiation Of Reference Spectra Library Generation For Op...
- Publication number 20140176949
- Publication date Jun 26, 2014
- Applied Materials, Inc.
- Jeffrey Drue David
- G01 - MEASURING TESTING
Information Patent Application
In-Sequence Spectrographic Sensor
- Publication number 20140141694
- Publication date May 22, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN C...
- Publication number 20140030956
- Publication date Jan 30, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Endpoint Detection During Polishing Using Integrated Differential I...
- Publication number 20140024291
- Publication date Jan 23, 2014
- Jimin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing Pad and Multi-Head Polishing System
- Publication number 20140024299
- Publication date Jan 23, 2014
- Wen-Chiang Tu
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Control Using Weighting With Default Sequence
- Publication number 20140024292
- Publication date Jan 23, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Control Of Overpolishing Of Multiple Substrates On the Same Platen...
- Publication number 20140024293
- Publication date Jan 23, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- Publication number 20140004626
- Publication date Jan 2, 2014
- Applied Materials, Inc.
- KUN XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN POLISHING PAD WITH WINDOW AND MOLDING PROCESS
- Publication number 20130309951
- Publication date Nov 21, 2013
- Applied Materials, Inc.
- Dominic J. Benvegnu
- B24 - GRINDING POLISHING

Jimin Zhang

Person

Patents Grantslast 30 patents

Wafer edge asymmetry correction using groove in polishing pad

Wafer edge asymmetry correction using groove in polishing pad

Chemical mechanical polishing using time share control

Chemical mechanical polishing using time share control

Apparatus and method of substrate edge cleaning and substrate carri...

Compensation for substrate doping for in-situ electromagnetic induc...

Asymmetry correction via variable relative velocity of a wafer

Chemical mechanical polishing using time share control

Chattering correction for accurate sensor position determination on...

Endpoint control of multiple substrate zones of varying thickness i...

Modifying substrate thickness profiles

Overpolishing based on electromagnetic inductive monitoring of tren...

Orbital polishing with small pad

Polishing control using weighting with default sequence

Endpoint detection during polishing using integrated differential i...

Thin polishing pad with window and molding process

Temperature control of chemical mechanical polishing

Detection of layer clearing using spectral monitoring

Automatic selection of reference spectra library

Endpoint control of multiple substrates of varying thickness on the...

Automatic initiation of reference spectra library generation for op...

Control of overpolishing of multiple substrates on the same platen...

Thin polishing pad with window and molding process

Polishing pad with partially recessed window

Method of making and apparatus having windowless polishing pad and...

Endpoint control of multiple-wafer chemical mechanical polishing

Use of pad conditioning in temperature controlled CMP

Method of making and apparatus having windowless polishing pad and...

Polishing pad with window having multiple portions

Pad conditioner

Patents Applicationslast 30 patents

SUBSTRATE HOT SPOT CORRECTION FOR A CHEMICAL MECHANICAL POLISHING P...

RETAINING-RING-LESS CMP PROCESS

PROCESS CONTROL METHOD FOR PATTERN WAFER INDEX POLISHING

DETERMINING THE ORIENTATION OF A SUBSTRATE IN-SITU

INDEX POLISHING FOR PROCESS CONTROL SIGNAL AND WAFER UNIFORMITY

APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY

WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD

APPARATUS AND METHOD OF SUBSTRATE EDGE CLEANING AND SUBSTRATE CARRI...

ASYMMETRY CORRECTION VIA VARIABLE RELATIVE VELOCITY OF A WAFER

CHEMICAL MECHANICAL POLISHING USING TIME SHARE CONTROL

APPARATUS AND METHOD OF SUBSTRATE EDGE CLEANING AND SUBSTRATE CARRI...

WAFER EDGE ASYMMETRY CORRECTION USING GROOVE IN POLISHING PAD

CHEMICAL MECHANICAL POLISHING USING TIME SHARE CONTROL

COMPENSATION FOR SUBSTRATE DOPING FOR IN-SITU ELECTROMAGNETIC INDUC...

Chattering Correction for Accurate Sensor Position Determination on...

OVERPOLISHING BASED ON ELECTROMAGNETIC INDUCTIVE MONITORING OF TREN...

MONITORING OF POLISHING PAD THICKNESS FOR CHEMICAL MECHANICAL POLIS...

ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...

ORBITAL POLISHING WITH SMALL PAD

Modifying Substrate Thickness Profiles

ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...

Automatic Initiation Of Reference Spectra Library Generation For Op...

In-Sequence Spectrographic Sensor

CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN C...

Endpoint Detection During Polishing Using Integrated Differential I...

Polishing Pad and Multi-Head Polishing System

Polishing Control Using Weighting With Default Sequence

Control Of Overpolishing Of Multiple Substrates On the Same Platen...

TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

THIN POLISHING PAD WITH WINDOW AND MOLDING PROCESS