Jiming LI

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure with dielectric structure covering...
- Patent number 11,824,031
- Issue date Nov 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,658,102
- Issue date May 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Yuanhao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 11,552,026
- Issue date Jan 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230298985
- Publication date Sep 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Yuanhao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230145588
- Publication date May 11, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210391291
- Publication date Dec 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225747
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Yuanhao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200251421
- Publication date Aug 6, 2020
- Advanced Semiconductor Engineering, Inc.
- Chen Yuang CHEN
- H01 - BASIC ELECTRIC ELEMENTS