Jimmy Hwee Seng Chew

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging method and package structure
- Patent number 12,080,565
- Issue date Sep 3, 2024
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 11,610,855
- Issue date Mar 21, 2023
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method, panel assembly, wafer package and chip package
- Patent number 11,538,695
- Issue date Dec 27, 2022
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 11,232,957
- Issue date Jan 25, 2022
- PEP INOVATION PTE. LTD.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip structure
- Patent number 11,233,028
- Issue date Jan 25, 2022
- PEP INOVATION PTE. LTD.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and package structure
- Patent number 11,114,315
- Issue date Sep 7, 2021
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method, panel assembly, wafer package and chip package
- Patent number 11,062,917
- Issue date Jul 13, 2021
- Pep Innovation PTE Ltd.
- Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and semiconductor package device using the...
- Patent number 10,763,133
- Issue date Sep 1, 2020
- Advanpack Solutions PTE LTD
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package device
- Patent number 10,109,503
- Issue date Oct 23, 2018
- Advanpack Solutions PTE LTD
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a flip chip on leadframe semiconductor package
- Patent number 6,550,666
- Issue date Apr 22, 2003
- Advanpack Solutions PTE LTD
- Jimmy Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20210398822
- Publication date Dec 23, 2021
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD, PANEL ASSEMBLY, WAFER PACKAGE AND CHIP PACKAGE
- Publication number 20200312676
- Publication date Oct 1, 2020
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD, PANEL ASSEMBLY, WAFER PACKAGE AND CHIP PACKAGE
- Publication number 20200312762
- Publication date Oct 1, 2020
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20200203296
- Publication date Jun 25, 2020
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP STRUCTURE
- Publication number 20200203302
- Publication date Jun 25, 2020
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20200203187
- Publication date Jun 25, 2020
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND PACKAGE STRUCTURE
- Publication number 20200203188
- Publication date Jun 25, 2020
- PEP INNOVATION PTE LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR PACKAGE DEVICE USING THE...
- Publication number 20190035643
- Publication date Jan 31, 2019
- Advanpack Solutions Pte Ltd
- Jimmy Hwee-Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE AND MANUFACTURING METHO...
- Publication number 20130020710
- Publication date Jan 24, 2013
- Advanpack Solutions Pte Ltd
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A FLIP CHIP ON LEADFRAME SEMICONDUCTOR PACKAGE
- Publication number 20030038162
- Publication date Feb 27, 2003
- Jimmy Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS

Jimmy Hwee Seng Chew

Person

Patents Grantslast 30 patents

Chip packaging method and package structure

Chip packaging method and package structure

Packaging method, panel assembly, wafer package and chip package

Chip packaging method and package structure

Chip packaging method and chip structure

Chip packaging method and package structure

Packaging method, panel assembly, wafer package and chip package

Semiconductor structure and semiconductor package device using the...

Method of manufacturing semiconductor package device

Method for forming a flip chip on leadframe semiconductor package

Patents Applicationslast 30 patents

CHIP PACKAGING METHOD AND PACKAGE STRUCTURE

PACKAGING METHOD, PANEL ASSEMBLY, WAFER PACKAGE AND CHIP PACKAGE

PACKAGING METHOD, PANEL ASSEMBLY, WAFER PACKAGE AND CHIP PACKAGE

CHIP PACKAGING METHOD AND PACKAGE STRUCTURE

CHIP PACKAGING METHOD AND CHIP STRUCTURE

CHIP PACKAGING METHOD AND PACKAGE STRUCTURE

CHIP PACKAGING METHOD AND PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR PACKAGE DEVICE USING THE...

SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE AND MANUFACTURING METHO...

METHOD FOR FORMING A FLIP CHIP ON LEADFRAME SEMICONDUCTOR PACKAGE