Jimmy Leong

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Eau Claire, WI, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a wafer level contact sheet having a permanent z-...
- Patent number 5,966,593
- Issue date Oct 12, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level burn-in system
- Patent number 5,966,022
- Issue date Oct 12, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Method of wafer level burn-in
- Patent number 5,896,038
- Issue date Apr 20, 1999
- W. L. Gore & Associates, Inc.
- John J. Budnaitis
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer interconnect system for an area array interconnection us...
- Patent number 5,276,955
- Issue date Jan 11, 1994
- SuperComputer Systems Limited Partnership
- David B. Noddin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF WAFER LEVEL BURN-IN
- Publication number 20020021138
- Publication date Feb 21, 2002
- JOHN J. BUDNAITIS
- G01 - MEASURING TESTING