Jin-Chyung Bai

Person

Hsin Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of circuit board
- Patent number 6,968,613
- Issue date Nov 29, 2005
- UltraTera Corporation
- Chung-Che Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,964,888
- Issue date Nov 15, 2005
- Ultratera Corporation
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test fixture for semiconductor package and test method of using the...
- Patent number 6,859,056
- Issue date Feb 22, 2005
- UltraTera Corporation
- Jin-Chuan Bai
- G01 - MEASURING TESTING
Information Patent Grant
Window-type ball grid array semiconductor package
- Patent number 6,822,337
- Issue date Nov 23, 2004
- Ultratera Corporation
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,790,712
- Issue date Sep 14, 2004
- United Test Center, Inc.
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method for circuit board
- Patent number 6,740,540
- Issue date May 25, 2004
- Ultra Tera Corporation
- Chung-Che Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Window-type semiconductor package and fabrication method thereof
- Patent number 6,710,434
- Issue date Mar 23, 2004
- Ultratera Corporation
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced IC chip package
- Patent number 6,614,660
- Issue date Sep 2, 2003
- Ultratera Corporation
- Jin-Chyung Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip photoelectric sensor assembly and method for making same
- Patent number 6,531,333
- Issue date Mar 11, 2003
- Hong-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,459,163
- Issue date Oct 1, 2002
- United Test Center, Inc.
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20040266067
- Publication date Dec 30, 2004
- United Test Center, Inc.
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window-type ball grid array semiconductor package
- Publication number 20040061222
- Publication date Apr 1, 2004
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW-TYPE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20040061243
- Publication date Apr 1, 2004
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW-TYPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE
- Publication number 20040061239
- Publication date Apr 1, 2004
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with reinforced substrate and fabrication met...
- Publication number 20040004277
- Publication date Jan 8, 2004
- Chung-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with heat sink
- Publication number 20040004281
- Publication date Jan 8, 2004
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board for flip-chip semiconductor package and fabrication m...
- Publication number 20040003940
- Publication date Jan 8, 2004
- Jin-Chuan Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board free of photo-sensitive material and fabrication meth...
- Publication number 20030184979
- Publication date Oct 2, 2003
- UltraTera Corporation
- Chung-Che Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication method of circuit board
- Publication number 20030182797
- Publication date Oct 2, 2003
- UltraTera Corporation
- Chung-Che Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication method for circuit board
- Publication number 20030173331
- Publication date Sep 18, 2003
- UltraTera Corporation
- Chung-Che Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Test fixture for semiconductor package and test method of using the...
- Publication number 20030151420
- Publication date Aug 14, 2003
- UltraTera Corporation
- Jin-Chuan Bai
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device without use of chip carrier and method for mak...
- Publication number 20030020183
- Publication date Jan 30, 2003
- Jin Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20020192860
- Publication date Dec 19, 2002
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging process for semiconductor package
- Publication number 20020187591
- Publication date Dec 12, 2002
- UNITED TEST CENTER, INC
- Jin Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip photoelectric sensor assembly and method for making same
- Publication number 20020153581
- Publication date Oct 24, 2002
- Hong-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SAME
- Publication number 20020135080
- Publication date Sep 26, 2002
- Jin-Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device without use of chip carrier and method for mak...
- Publication number 20020041039
- Publication date Apr 11, 2002
- UNITED TEST CENTER, INC
- Jin Chuan Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip photoelectric sensor assembly and method for making same
- Publication number 20010029059
- Publication date Oct 11, 2001
- Hong-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS

Jin-Chyung Bai

Person

Patents Grantslast 30 patents

Fabrication method of circuit board

Semiconductor device and method for fabricating the same

Test fixture for semiconductor package and test method of using the...

Window-type ball grid array semiconductor package

Semiconductor device and method for fabricating the same

Fabrication method for circuit board

Window-type semiconductor package and fabrication method thereof

Thermally enhanced IC chip package

Chip photoelectric sensor assembly and method for making same

Semiconductor device and method for fabricating the same

Patents Applicationslast 30 patents

Semiconductor device and method for fabricating the same

Window-type ball grid array semiconductor package

WINDOW-TYPE SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

WINDOW-TYPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Semiconductor package with reinforced substrate and fabrication met...

Semiconductor package with heat sink

Circuit board for flip-chip semiconductor package and fabrication m...

Circuit board free of photo-sensitive material and fabrication meth...

Fabrication method of circuit board

Fabrication method for circuit board

Test fixture for semiconductor package and test method of using the...

Semiconductor device without use of chip carrier and method for mak...

Semiconductor device and method for fabricating the same

Packaging process for semiconductor package

Chip photoelectric sensor assembly and method for making same

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SAME

Semiconductor device without use of chip carrier and method for mak...

Chip photoelectric sensor assembly and method for making same