Jin-Feng Yang

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate structures, methods for forming the same and semiconducto...
- Patent number 11,482,482
- Issue date Oct 25, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,075,186
- Issue date Jul 27, 2021
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having vapor chamber thermally conn...
- Patent number 11,024,557
- Issue date Jun 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,840,219
- Issue date Nov 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,770,369
- Issue date Sep 8, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 10,410,942
- Issue date Sep 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Tsan-Hsien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,332,862
- Issue date Jun 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal-enhanced conformal shielding an...
- Patent number 9,984,983
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal-enhanced conformal shielding an...
- Patent number 9,484,313
- Issue date Nov 1, 2016
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal dissipation structures and EMI...
- Patent number 8,704,341
- Issue date Apr 22, 2014
- Advanced Semiconductor Engineering, Inc.
- I-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE STRUCTURES, METHODS FOR FORMING THE SAME AND SEMICONDUCTO...
- Publication number 20220084926
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200091036
- Publication date Mar 19, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-En CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200066612
- Publication date Feb 27, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190287947
- Publication date Sep 19, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190164859
- Publication date May 30, 2019
- Advanced Semiconductor Engineering, Inc.
- Tsan-Hsien CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190074264
- Publication date Mar 7, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180226320
- Publication date Aug 9, 2018
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...
- Publication number 20170012007
- Publication date Jan 12, 2017
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...
- Publication number 20140239464
- Publication date Aug 28, 2014
- Advanced Semiconductor Engineering, Inc.
- Chi-Sheng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION STRUCTURES AND EMI...
- Publication number 20130307128
- Publication date Nov 21, 2013
- I-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS

Jin-Feng Yang

Person

Patents Grantslast 30 patents

Substrate structures, methods for forming the same and semiconducto...

Semiconductor package

Semiconductor package structure having vapor chamber thermally conn...

Semiconductor package structure and method for manufacturing the same

Semiconductor device package

Semiconductor device package and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor packages with thermal-enhanced conformal shielding an...

Semiconductor packages with thermal-enhanced conformal shielding an...

Semiconductor packages with thermal dissipation structures and EMI...

Patents Applicationslast 30 patents

SUBSTRATE STRUCTURES, METHODS FOR FORMING THE SAME AND SEMICONDUCTO...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...

SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AN...

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION STRUCTURES AND EMI...