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Jin Gul Hyun

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Patents Grantslast 30 patents

  • Information Patent Grant

    Coil component
    • Patent number 11,636,971
    • Issue date Apr 25, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ye Eun Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor including high-rigidity insulating layers
    • Patent number 11,600,430
    • Issue date Mar 7, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jong Yoon Jang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor
    • Patent number 11,017,930
    • Issue date May 25, 2021
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Mi Sun Hwang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method of manufacturing an inductor
    • Patent number 10,763,031
    • Issue date Sep 1, 2020
    • Samsung Electro-Mechanics Co., Ltd.
    • Jong Yoon Jang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    COIL COMPONENT
    • Publication number 20210043359
    • Publication date Feb 11, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Ye Eun Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20200365313
    • Publication date Nov 19, 2020
    • Samsung Electro-Mechanics Co., Ltd.
    • Jong Yoon JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR
    • Publication number 20190244739
    • Publication date Aug 8, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Mi Sun HWANG
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    INDUCTOR AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20180061555
    • Publication date Mar 1, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Jong Yoon JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR SUBSTRATE HAVING CRACK PREVENTING STRUCTURE AND METHO...
    • Publication number 20140061864
    • Publication date Mar 6, 2014
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Gul HYUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20130153275
    • Publication date Jun 20, 2013
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jin Gul Hyun
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20130153266
    • Publication date Jun 20, 2013
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Gul Hyun
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR