Jin Ho Gwon

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Gyeonggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and stacked semiconductor package having the...
- Patent number 9,070,691
- Issue date Jun 30, 2015
- SK Hynix Inc.
- Jae Sung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and stacked semiconductor package having the...
- Patent number 8,823,158
- Issue date Sep 2, 2014
- SK Hynix Inc.
- Jae Sung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and stacked semiconductor package having the...
- Patent number 8,299,591
- Issue date Oct 30, 2012
- Hynix Semiconductor Inc.
- Jae Sung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor package having a reinforcing member tha...
- Patent number 8,024,857
- Issue date Sep 27, 2011
- Hynix Semiconductor Inc.
- Young Hy Jung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE...
- Publication number 20140332946
- Publication date Nov 13, 2014
- Jae Sung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE...
- Publication number 20130026651
- Publication date Jan 31, 2013
- Hynix Semiconductor Inc.
- Jae Sung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING A REINFORCING MEMBER THA...
- Publication number 20100117200
- Publication date May 13, 2010
- Young Hy JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE...
- Publication number 20100072598
- Publication date Mar 25, 2010
- Jae Sung OH
- H01 - BASIC ELECTRIC ELEMENTS